23360 logic cells in a 13x13 mm footprint
The AMD XC7S25-2CSGA225I is a Spartan®-7 FPGA packing 23360 logic elements (1825 CLBs) and 150 user I/O into a 225-ball CSGA package measuring 13x13 mm. With 1658880 total block RAM bits, it has enough on-chip memory for moderate FIFO buffers, line-rate packet processing, or small frame stores without external SRAM.
Industrial temperature and supply rails
Core supply is 0.95V to 1.05V — a tight 100 mV window that demands a regulated rail with less than 30 mV ripple at the FPGA's transient load step.
Fully ROHS3 compliant, it passes the current EU restriction directive without exempted substances.
Board integration in 225-CSGA
The 225-ball chip-scale BGA (CSGA) with 0.8 mm pitch requires a 4-layer PCB minimum for fan-out — the inner rows route through via-in-pad or dog-bone traces to the inner layers. Surface-mount assembly with a standard lead-free reflow profile; the 13x13 mm body fits tight card-edge placements where board real estate is at a premium.