Logic fabric and on-chip memory for the BOM line
The AMD XC7S25-1CSGA225C is a Spartan®-7 FPGA delivering 23360 logic cells arranged in 1825 CLB slices, with 1658880 total block RAM bits distributed across the fabric. The 150 user I/O are accessible through the 225-ball CSGA package, which uses a 13x13 mm footprint with 0.8 mm ball pitch — a layout that routes comfortably on a 4-layer board without microvia fan-out. The core supply operates from 0.95 V to 1.05 V, placing it in the 1.0 V nominal rail class common to 28 nm FPGA designs. The commercial temperature grade (0°C to 85°C junction) suits controlled indoor environments — telecom central office, industrial controller chassis, or benchtop instrumentation — where ambient stays below 70°C and the thermal design keeps the die within the TJ limit.
Package, footprint, and board integration
The 225-LFBGA / CSPBGA package (supplier device package 225-CSGA) is a fine-pitch BGA with a 13x13 mm body. The 0.8 mm ball pitch allows escape routing on two signal layers with a single via per ball, though a 4-layer stack-up with a dedicated ground plane under the BGA region is recommended to control the return-current path for the I/O banks. The tray packaging indicates the device ships in matrix trays suitable for pick-and-place without tape-and-reel handling. Surface-mount assembly follows standard JEDEC MSL-3 moisture sensitivity for 28 nm BGA devices — a 168-hour floor life after bake, with reflow profile per IPC/JEDEC J-STD-020.
Active lifecycle and compliance posture
No pin-compatible second source or direct replacement is listed — the Spartan-7 family is a single-sourced AMD architecture, so the BOM should carry a risk flag if sole-source mitigation is required.