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AMD XC7A35T-2CSG325C — FPGA / CPLD & Programmable Logic

AMD XC7A35T-2CSG325C Artix-7 FPGA, 33K logic cells, 150 I/O

MPNXC7A35T-2CSG325C
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AMD Artix-7 FPGA, XC7A35T-2CSG325C, 33,280 logic cells, 150 I/O, 1.8 Mbit block RAM, 324-ball CSPBGA, 0.95–1.05 V supply, commercial temp.

$68.6700Ref. price · indicative, final on quote
Packaging324-LFBGA, CSPBGA
RoHSROHS3 Compliant
SeriesArtix-7
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

XC7A35T-2CSG325C specifications
ParameterValue
SeriesArtix-7
MountingSurface Mount
Voltage0.95V ~ 1.05V
Operating temperature0°C ~ 85°C (TJ)
PackageTray
Number of i (O)150
Case324-LFBGA, CSPBGA
Total RAM bits1843200
Number of LABs (CLBs)2600
Number of logic elements (Cells)33280

Product details

Logic capacity and I/O budget for the design

The XC7A35T-2CSG325C packs 33,280 logic cells arranged in 2600 CLB slices — enough for mid-complexity glue logic, state machines, or a soft-core processor with peripheral fabric. The 150 user I/O in the 324-ball CSPBGA package gives you headroom for a parallel bus, a DDR memory interface, and a handful of control signals without starving the pinout. On-chip block RAM totals 1,843,200 bits (1.8 Mbit) — budget this for FIFOs, small frame buffers, or coefficient tables. If your application needs more than that, the Artix-7 fabric connects to external DDR3 via the memory controller hard block on the same die, though the I/O count and package choice limit the bus width.

Supply rails and temperature grade

Core voltage is 1.0 V nominal with a 0.95–1.05 V window — the FPGA's internal LDOs and PLLs expect this rail clean to within 50 mV ripple. The commercial temperature grade (0 °C to 85 °C junction) suits controlled indoor environments, telecom shelters, and benchtop instrumentation. For extended industrial or outdoor use, the Artix-7 family offers an industrial-grade variant (XC7A35T-2CSG325I) with a -40 °C to 100 °C TJ range, though the BOM cost and availability differ.

Package footprint and board-level integration

The 324-ball CSPBGA (15x15 mm, 0.8 mm pitch) demands a 6- to 8-layer PCB for fan-out — the inner rows of balls route through buried vias. The package is lead-free and compatible with standard reflow profiles (peak 245 °C). No exposed thermal pad; the die heat dissipates through the balls into the board copper. A 2-oz copper plane under the BGA footprint with thermal vias to the bottom layer keeps the junction temperature within the 85 °C ceiling.

Active lifecycle and compliance posture

It is ROHS3 compliant (lead-free, no restricted substances above the threshold). The base product number XC7A35 covers multiple speed grades (-1, -2, -3) and temperature ranges; the -2 speed grade is the mid-range bin, balancing logic performance against static power for most designs.

Frequently asked questions

What is the closest pin-compatible alternative to the XC7A35T-2CSG325C?

Within the Artix-7 family, the XC7A35T-2CSG325I (industrial temperature grade, -40 to +100 °C TJ) shares the same 324-ball CSPBGA footprint and pinout. The only difference is the operating temperature range — the board layout, decoupling, and power supply design transfer without changes.

What compliance documentation does AMD provide for the XC7A35T-2CSG325C?

The part is ROHS3 compliant per AMD's material declaration. Standard compliance documentation includes the ROHS certificate of compliance, REACH SVHC declaration, and the PCN notification history. These are available through the distributor upon RFQ.