Active lifecycle — BOM-fit for current designs
The XC7A35T-2CSG324I: ROHS3 compliant — no restricted substances above the threshold, so it passes into European and domestic assemblies without a RoHS exemption note on the BOM.
Logic fabric and on-chip memory budget
33,280 logic cells arranged in 2,600 CLB slices — enough for a soft-core processor plus peripheral glue logic without resorting to external CPLD or discrete logic. 1,843,200 total block RAM bits (1.8 Mbit) provide on-chip buffering for video lines, packet FIFOs, or coefficient storage, reducing off-chip SRAM demand.
I/O count and package footprint
210 user I/O in a 324-ball CSPBGA (15x15 mm) — the ball pitch is 0.8 mm, which routes cleanly on a 4-layer board with blind vias for the inner rows. Core supply range is 0.95 V to 1.05 V; the 1.0 V nominal rail needs a local regulator within 2 inches of the package to keep IR drop under 25 mV at full toggle.
Temperature grade and deployment environment
Surface-mount assembly on standard reflow profiles; the 324-CSPBGA is MSL 3 typical for this package class, so a bake is required if the floor life exceeds the label seal date.