Logic fabric and on-chip memory for the BOM
The XC7A35T-1CSG325I packs 33,280 logic cells organised into 2,600 CLB slices — enough fabric for a moderate-density glue-logic aggregation, a soft-core microcontroller, or a custom DSP datapath without resorting to a larger device. The 1,843,200 total block RAM bits handle FIFO buffering and small frame stores on-chip, keeping the external memory interface lean. With 150 user I/O brought out to a 324-ball CSPBGA, the I/O-to-ball ratio is about 46% — the remaining balls are power and ground, which is typical for a mid-range FPGA. The 15x15 mm package fits on a standard 4-layer board; the 0.8 mm ball pitch means you can route the outer rows on the top layer without micro-vias, but the inner rows need at least a via-in-pad or a dog-bone breakout.
Package rework and board-fit reality
The core supply range is 0.95 V to 1.05 V — a tight window. A 1.0 V rail with ±3% regulation covers it, but the PCB trace resistance from the regulator to the FPGA balls must stay under 5 mΩ to keep the IR drop inside the tolerance. The industrial temperature grade means the part is characterised for junction temperatures from -40°C to 100°C, so it can sit in an outdoor cabinet or a factory floor enclosure without derating.
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