AMD XC6SLX16-2CSG225I — FPGA / CPLD & Programmable Logic
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RoHS Compliant · Lead-Free EIA-481 Standard
AMD / FPGA / CPLD & Programmable Logic

AMD XC6SLX16-2CSG225I Spartan-6 LX FPGA, 14579 LEs

MPN XC6SLX16-2CSG225I
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

AMD Spartan®-6 LX FPGA, 14579 logic cells, 589824 total RAM bits, 160 I/O, 225-LFBGA/CSPBGA, 1.14V-1.26V core, -40°C to 100°C, Tray.

In Stock: 237 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$15.39 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$15.39
10+ pcs
$14.61
30+ pcs
$13.25
100+ pcs
$12.07
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$15.39 / ea

237 in stock — maximum per order · 3–4 days lead time

$14.61 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (10)
Package / Case 225-LFBGA, CSPBGA
Supply Voltage 1.14V ~ 1.26V

Full Technical Specifications

10 Parameters
XC6SLX16-2CSG225I specifications
Parameter / AttributeSpecification / Value
SeriesSpartan®-6 LX
MountingSurface Mount
Supply voltage1.14V ~ 1.26V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)160
Case225-LFBGA, CSPBGA
Total RAM bits589824
Number of LABs (CLBs)1139
Number of logic elements (Cells)14579
Series Sibling Variants

AMD Spartan®-6 LX Series Models

Sibling variants, package options, and speed/density grades in this AMD semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

Device identity and logic fabric

The XC6SLX16-2CSG225I is a member of the AMD Spartan-6 LX family, a low-power FPGA architecture built on a 45 nm process. It delivers 14,579 logic cells organised into 1,139 configurable logic blocks (CLBs/LABs), providing the fabric for glue logic, state machines, or lightweight DSP datapaths. On-chip block RAM totals 589,824 bits, sufficient for small FIFOs, line buffers, or coefficient storage without external memory. The 160 user I/O pins, accessible through the 225-ball CSPBGA package (13 mm × 13 mm), support single-ended and differential standards up to the bank voltage limits.

Supply rails and temperature grade

Core logic operates from a 1.14 V to 1.26 V supply rail, typical of the 45 nm low-power process. The 225-CSPBGA package (supplier device package 225-CSPBGA, 13 mm × 13 mm) requires a 4- to 6-layer PCB for fan-out of the 160 I/O and the core supply decoupling. The 0.8 mm ball pitch is compatible with standard assembly processes; a solder mask defined pad is recommended for reliable ball attach.

Lifecycle and compliance

The device is ROHS3 compliant, meeting the current exemption-free restriction levels for lead, mercury, and cadmium.

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