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AMD XC6SLX16-2CSG225I — FPGA / CPLD & Programmable Logic

AMD XC6SLX16-2CSG225I Spartan-6 LX FPGA, 14579 LEs

MPNXC6SLX16-2CSG225I
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AMD Spartan®-6 LX FPGA, 14579 logic cells, 589824 total RAM bits, 160 I/O, 225-LFBGA/CSPBGA, 1.14V-1.26V core, -40°C to 100°C, Tray.

$57.0500Ref. price · indicative, final on quote
Packaging225-LFBGA, CSPBGA
RoHSROHS3 Compliant
SeriesSpartan®-6 LX
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

XC6SLX16-2CSG225I specifications
ParameterValue
SeriesSpartan®-6 LX
MountingSurface Mount
Voltage1.14V ~ 1.26V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)160
Case225-LFBGA, CSPBGA
Total RAM bits589824
Number of LABs (CLBs)1139
Number of logic elements (Cells)14579

Product details

Device identity and logic fabric

The XC6SLX16-2CSG225I is a member of the AMD Spartan-6 LX family, a low-power FPGA architecture built on a 45 nm process. It delivers 14,579 logic cells organised into 1,139 configurable logic blocks (CLBs/LABs), providing the fabric for glue logic, state machines, or lightweight DSP datapaths. On-chip block RAM totals 589,824 bits, sufficient for small FIFOs, line buffers, or coefficient storage without external memory. The 160 user I/O pins, accessible through the 225-ball CSPBGA package (13 mm × 13 mm), support single-ended and differential standards up to the bank voltage limits.

Supply rails and temperature grade

Core logic operates from a 1.14 V to 1.26 V supply rail, typical of the 45 nm low-power process. The 225-CSPBGA package (supplier device package 225-CSPBGA, 13 mm × 13 mm) requires a 4- to 6-layer PCB for fan-out of the 160 I/O and the core supply decoupling. The 0.8 mm ball pitch is compatible with standard assembly processes; a solder mask defined pad is recommended for reliable ball attach.

Lifecycle and compliance

The device is ROHS3 compliant, meeting the current exemption-free restriction levels for lead, mercury, and cadmium.