W25N512GWEIT
Winbond Electronics
Tray-40°C~85°C(TA)SpiFlash®
Ref. price$2.3226
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Winbond Electronics W25N512GW Series
18 variants · Winbond Electronics
About the Winbond Electronics W25N512GW Series
The Winbond Electronics W25N512GW Series series groups 18 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. The listed variants share a common access time of 7 ns, frequency of 104 MHz and memory format of FLASH. Variants differ by case, operating temperature and package, so you can match the exact case your application requires using the selection guide below.
Select a variant by
- Case
- 8-WDFN Exposed Pad · 16-SOIC (0.295\", 7.50mm Width) · 24-TBGA · 48-UFBGA, WLCSP
- Operating temperature
- -40°C ~ 85°C (TA) · -40°C~85°C(TA)
- Package
- Tape & Reel (TR) · Tray
Shared specifications
- Access time
- 7 ns
- Frequency
- 104 MHz
- Memory format
- FLASH
- Memory interface
- SPI - Quad I/O
- Memory organization
- 64M x 8
- Memory size
- 512Mbit
- Memory type
- Non-Volatile
- Mounting
- Surface Mount
- Technology
- FLASH - NAND (SLC)
- Voltage
- 1.7V ~ 1.95V
- Write cycle time - word, page
- 700µs
Variant comparison
| Parameter | W25N512GWBIR | W25N512GWBIR TR | W25N512GWBIT TR | W25N512GWEIT | W25N512GWEIT TR | W25N512GWFIT |
|---|---|---|---|---|---|---|
| Case | 24-TBGA | 24-TBGA | 24-TBGA | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad | 16-SOIC (0.295\", 7.50mm Width) |
| Operating temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C~85°C(TA) | -40°C~85°C(TA) | -40°C ~ 85°C (TA) |
| Package | Tray | Tape & Reel (TR) | Tape & Reel (TR) | Tray | Tape & Reel (TR) | Tray |
Request a quote on any Winbond Electronics W25N512GW Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
