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Winbond Electronics W25Q128JVSIM TR — Memory (DRAM / SRAM / Flash / EEPROM)

W25Q128JVSIM TR 128Mbit SPI Flash 3.3V 8-SOIC — Winbond | ICBOMS

MPNW25Q128JVSIM TR
Active

IC FLASH 128MBIT SPI/QUAD 8SOIC

$5.17893Ref. price · indicative, final on quote
Packaging8-SOIC (0.209", 5.30mm Width)
RoHSROHS3 Compliant
SeriesSpiFlash®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

W25Q128JVSIM TR specifications
ParameterValue
SeriesSpiFlash®
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency133 MHz
Memory interfaceSPI - Quad I/O, QPI, DTR
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyFLASH - NOR
Memory size128Mbit
Memory formatFLASH
Case8-SOIC (0.209\", 5.30mm Width)
Memory organization16M x 8
Write cycle time - word, page3ms

Product details

The Winbond W25Q128JVSIM TR is a 128 Mbit (16 MB) SpiFlash® serial NOR flash organized as 16M x 8 in an 8-pin SOIC with the 0.209 inch (5.30 mm) wide body, delivered on tape and reel with cut-tape available. It runs from a 2.7 V to 3.6 V supply over -40°C to 85°C.

The 133 MHz clock drives the full quad-era interface set: Dual/Quad I/O plus QPI and DTR. QPI eliminates the single-wire command phase by moving the instruction onto all four I/O lines, and DTR strobes data on both edges of the clock. The result is reduced read protocol overhead, valuable where boot-time and firmware-update duration are specification-level requirements rather than preferences. Page program is rated at 3 ms.

The wide-body SOIC-8 is the workhorse footprint of the W25Q family. Gull-wing leads are easier to inspect, probe, and rework than WSON pads, and the larger body spreads heat across the board. If your assembly house or rework station is set up for leaded parts, this variant integrates without any footprint change.

The JVSIM is the tape-and-reel version of the SOIC-8 128 Mbit part, a direct pairing with the tube-packaged W25Q128JVSIQ; boards designed for either can accept both. If board area is the binding constraint instead, the W25Q128JVPIM in the 6 x 5 WSON carries the same density and interface set in a smaller footprint.