Skip to main content
Winbond Electronics W29N02KVSIAF TR — Crystals & Oscillators

Winbond W29N02KVSIAF TR 2Gbit SLC NAND Flash, 48-TSOP

MPNW29N02KVSIAF TR
End of Life

Winbond Electronics W29N02KVSIAF TR SLC NAND Flash, 2Gbit, 20ns access, Parallel interface, 2.7V-3.6V, -40°C to 85°C, 48-TSOP, Tape & Reel.

$5.17Ref. price · indicative, final on quote
Packaging48-TFSOP (0.724", 18.40mm Width)
StockIn Stock (23)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

W29N02KVSIAF TR Technical Specifications
ParameterValue
Memory typeNon-Volatile
Mounting typeSurface Mount
Voltage2.7V ~ 3.6V
Memory interfaceParallel
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyFLASH - NAND (SLC)
Access time20 ns
Memory size2Gbit
Memory formatFLASH
Case48-TFSOP (0.724\", 18.40mm Width)
Memory organization256M x 8
Write cycle time - word, page25ns

Product details

2 Gbit SLC NAND in a 48-TSOP footprint

The Winbond W29N02KVSIAF TR is a 2 Gbit SLC NAND flash memory in a 48-TSOP package, organized as 256M x 8 bits with a parallel interface. The 20 ns access time suits code-shadowing and data-logging applications where the host controller reads directly from the flash bus without a DRAM cache. SLC NAND delivers higher endurance and faster program/erase cycles than MLC or TLC alternatives — the 25 ns write cycle time per page reflects the single-level cell architecture's inherent speed advantage. For designs that cycle through firmware updates or store telemetry in the field, SLC avoids the wear-leveling overhead that denser NAND grades require.

Supply voltage and temperature grade

The 48-TSOP footprint (0.724" body width) is a standard NAND package — the pinout matches legacy parallel-NAND controllers from NXP, STMicroelectronics, and Microchip. Board layout re-use from an older 1 Gbit or 512 Mbit SLC NAND is straightforward as long as the supply decoupling and signal routing follow the 48-TSOP land pattern.

ROHS3 compliant, which covers the EU RoHS exemption list through 2024. No AEC-Q100 or automotive-grade qualification is stated in the available documentation.

Frequently asked questions

Will W29N02KVSIAF TR drop into a board designed for W29N04GVBIAA?

The W29N04GVBIAA is a 4 Gbit device in a different package (tray vs tape & reel) with an ONFI interface, not the parallel interface of the W29N02KVSIAF TR. The pinout and command set differ — a board designed for the W29N04GVBIAA requires layout changes to accept this part.

What compliance documentation does Winbond provide for W29N02KVSIAF TR?

Winbond certifies ROHS3 compliance for this part. No UL, IEC, or REACH documentation is listed in the available records.