The Winbond W25Q128JVPIM TR is a 128 Mbit (16 MB) SpiFlash® serial NOR flash organized as 16M x 8, and it is the compact-footprint member of the W25Q128 family: the 8-lead WDFN die ships as an 8-WSON measuring just 6 mm x 5 mm, in both tape-and-reel and cut-tape options.
Despite the small body, this variant keeps the full speed feature set of the 128 Mbit generation. The 133 MHz clock is combined with Quad I/O, QPI, and DTR interfaces. QPI moves the command phase onto the quad bus, and DTR latches data on both clock edges, so read and program traffic carries less protocol overhead than a conventional quad interface. That pays off in faster boot and in shorter OTA update downtime in the field.
It operates from 2.7 V to 3.6 V over -40°C to 85°C, with a 3 ms page program time. The 6 x 5 WSON body is roughly one-third smaller in area than the 8 x 6 WSON used by the W25Q128JVEIQ, and substantially smaller than an SOIC-8, which helps when routing the flash beside a dense MCU or module.
For designers who measure every square millimeter, the JVPIM puts 16 MB plus QPI/DTR performance into the smallest package Winbond offers at this density. Prototype with the cut-tape option and commit to reel for production. If you need the identical die in an SOIC-8 body for legacy assembly lines, the W25Q128JVSIM is the equivalent leaded choice in this batch.