IRF830APBF

Vishay

Vishay IRF830APBF, N-Channel MOSFET, 500 Vdss, 5 A Id, 1.4 Ohm Rds(on) at 10 V, 24 nC Qg, TO-220AB through-hole, -55 to 150 °C.

Vishay IRF830APBF
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[IN STOCK] In Stock: 24 pcs
$2.46/ pc

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Technical specifications

IRF830APBF specifications
Parameter / AttributeSpecification / Value
FET typeN-Channel
MountingThrough Hole
Drain to source voltage500 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C5A (Tc)
Power dissipation74W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTube
Vgs±30V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4.5V @ 250µA
Rds on (Max) @ id, vgs1.4Ohm @ 3A, 10V
Gate charge (Qg) (Max) @ vgs24 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds620 pF @ 25 V
100% Footprint Match · Solder-Ready (No PCB Redesign Needed)

Need Stock or a Drop-in Second-Source for IRF830APBF?

Package: TO-220AB (IRFI versions: TO-220 FullPak) · Pin-compatible replacements with immediate Shenzhen spot stock

Footprint Match 97%
Supply Chain & Allocation Reality:

The IRF820/830/840 family is the 500V TO-220 workhorse line of off-line SMPS repair, electronic ballasts and the primary-side switching of a generation of power supplies: same 500V body, same ±20V gates, three current classes - 2.5A at 3 ohms, 4.5A at 1.5 ohms, 8A at 0.85 ohms - plus insulated FullPak variants that trade current for a plastic tab. The substitutions inside the ladder follow one arithmetic (up is free after a gate-charge check, down costs conduction loss), and the drawer trap lives one part number away: the IRFZ44N that sits next to them in every TO-220 bin is a 55-VOLT part from the low-voltage world, and the wrong grab turns a mains supply repair into a fireworks display.

Verified Pin-Compatible Replacements (3 verified alternatives)

IRF830 Vishay / STMicroelectronics / Infineon TO-220AB
Functional Equivalent
Availability & Target Pricing:

The 4.5A Middle Rung

Shenzhen Spot Stock (24-48h Dispatch)

Electrical & Core Specs:

The middle die of the 500V ladder: 4.5A at about 1.5 ohms against the 8A and 0.85 ohms of the 840 - same envelope, a little over half the current and a warmer time at load.

Same 500V Vdss and ±20V gate window.

Compatibility & Drop-In Notes: Ballast and SMPS duty make the loss audible: the higher on-resistance lands directly on the heatsink, and boards sized around the 840 may run the 830 into thermal trouble at real load. Measure current, not the drawer label.
Package & Solder Footprint: Same TO-220AB footprint across the ladder.
Shenzhen Warehouse Stock & MOQ: Stocked; the matched-rung discipline applies.
IRF820 Vishay / STMicroelectronics TO-220AB
Functional Equivalent
Availability & Target Pricing:

The 2.5A Bottom Rung for Ballast Duty

Shenzhen Spot Stock (24-48h Dispatch)

Electrical & Core Specs:

The smallest die: 2.5A at about 3 ohms - the original ballast and small-adapter part, where the load genuinely sits in the amp class.

Same 500V class; the gate charge is the low end (about a third of the 840) which is why ballast drivers loved it.

Compatibility & Drop-In Notes: Gate-load note in the other direction: drivers designed around the 820 cannot always source the charge of an 840 - the upgrade is electrically kind and gate-budget dependent at the same time.
Package & Solder Footprint: TO-220AB, same pinout.
Shenzhen Warehouse Stock & MOQ: Stocked; the honest small rung.
IRFI840G / IRFI830G Vishay TO-220 FullPak (isolated tab)
Functional Equivalent
Availability & Target Pricing:

The Insulated Body, At a Price in Current

Shenzhen Spot Stock (24-48h Dispatch)

Electrical & Core Specs:

The fully-isolated versions: the plastic FullPak body removes the mica and the isolation kit from the thermal path - and the insulation costs current class (about 4.6A for the 840 die, 3.1A for the 830).

Same 500V and gate ratings; the difference is mounting and dissipation.

Compatibility & Drop-In Notes: The substitution reading: FullPak into the metal-tab socket is easy mounting, tighter thermal margin - check the dissipation math. Metal-tab into a FullPak position adds the insulation job back.
Package & Solder Footprint: FullPak is taller and requires the movable clip or screw through the hole; the tab is isolated by construction.
Shenzhen Warehouse Stock & MOQ: Stocked; the production-friendliness option.
Buyer & Quality Checklist for Sourcing Alternatives
  • Voltage class before anything: IRF820/830/840 are all 500V parts for off-line duty; the IRFZ44N that shares their TO-220 bin is 55V and the IRF540N is 100V. Three drawers, three different worlds of rail - read Vdss off the part, never off the shape.
  • The ladder arithmetic: 2.5A/3 ohm (820), 4.5A/1.5 ohm (830), 8A/0.85 ohm (840). Up the ladder is free margin electrically; down the ladder is conduction loss in an SMPS or ballast that measured its heatsink around the original.
  • Gate charge scales with the die: the 840 asks for roughly 63nC class against a third of that at the 820 - a driver sized for the small part may edge-turn the big one, and a driver sized for the big part drives the small one like a switch. Check the gate drive when crossing rungs.
  • The FullPak variants (IRFI prefix) trade current for mounting simplicity: insulated tab, no mica, lower current class (4.6A for the 840 die). The substitution is thermal before it is electrical.
  • In ballast and resonant SMPS duty the surrounding network is tuned: gate resistors, snubbers and the drain clamp all expect a given die - a rung change without re-checking edges turns EMI and dv/dt stress into the next failure.
  • Counterfeit reading on this ladder: a re-marked lower-class die under an 840 stamping shows up as on-resistance and thermal behavior outside the datasheet curve - curve-trace and load-test the first unit of any broker lot before it joins the drawer.
Frequently Asked Technical Questions

Q: Can an IRF830 replace an IRF840?

A: Same 500V class and footprint, lower current and higher on-resistance: it works only at re-measured load, since the extra loss lands on the heatsink. The reverse - 840 into an 830 socket - is free margin electrically, subject to the gate-charge check.

Q: What is the difference between IRF840 and IRFZ44N?

A: Voltage class: 500V against 55V. Both are TO-220 N-channel MOSFETs that share repair drawers, which is exactly how a mains-side supply gets a low-voltage part fitted - and then explodes. Read the voltage, not the package.

Q: What does the IRFI prefix mean?

A: The insulated FullPak body: the same 500V die in a fully isolated plastic package that removes the mica washer and mounting kit from the thermal path, at the cost of a lower current class (about 4.6A for the 840 die).

Technical details

500 V N-channel in a TO-220AB — where it fits

The IRF830APBF is a 500 V, 5 A N-channel power MOSFET in the through-hole TO-220AB package, built on planar MOSFET technology. It targets offline AC-DC converters, PFC boost stages, and 48 V telecom brick supplies where the 500 V drain-source rating provides adequate margin for universal-input flyback designs.

Maximum on-resistance is 1.4 Ohm at 3 A drain current with a 10 V gate drive. At the full 5 A continuous drain rating, conduction loss reaches I²R = 35 W — well within the 74 W package dissipation limit at the case, but the designer must derate for ambient temperature and heatsink thermal resistance. Total gate charge is 24 nC at 10 V. A typical gate-driver IC sourcing 1 A peak can switch this MOSFET in under 30 ns, keeping the switching transition within the safe-operating area for hard-switched topologies up to about 100 kHz.

Temperature range and package — board-level fit

The junction temperature range spans -55 °C to 150 °C, suiting the part for industrial and telecom environments where the ambient may reach 85 °C and the heatsink runs hot. The TO-220AB lead form matches the standard 0.100-inch pitch hole pattern on a 2-layer PCB; the metal tab requires electrical isolation or a shared drain node.

IRF830APBF
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