Toshiba Semiconductor TC75W55FK(TE85L,F) — Sensors & Transducers
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RoHS Compliant · Lead-Free EIA-481 Standard
Toshiba Semiconductor / Sensors & Transducers

TC75W55FK(TE85L,F) Dual CMOS Op-Amp – 160 kHz, 20 µA

MPN TC75W55FK(TE85L,F)
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Toshiba Semiconductor TC75W55FK(TE85L,F), dual CMOS operational amplifier, 160 kHz gain bandwidth, 20 µA supply per channel, 1.8 V to 7 V supply span, in 8-VFSOP (2.30 mm width) surface-mount package.

In Stock: 3,085 pcs
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[SPEC] Essential Parameters Snapshot Full Specifications (12)
Package / Case 8-VFSOP (0.091", 2.30mm Width)
Supply Voltage 1.8 V

Full Technical Specifications

12 Parameters
TC75W55FK(TE85L,F) specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Amplifier typeCMOS
Voltage - input offset2 mV
Voltage - supply span1.8 V
Current - supply20µA
Current - input bias1 pA
Operating temperature-40°C ~ 85°C
Gain bandwidth product160 kHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate0.08V/µs
Case8-VFSOP (0.091\", 2.30mm Width)
Number of circuits2
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Technical Details & Description

Dual CMOS op-amp for low-power sensor signal conditioning

The TC75W55FK(TE85L,F): The TC75W55FK is a dual-channel CMOS operational amplifier from Toshiba, designed for battery-powered sensor interfaces and portable instrumentation where supply current is the primary constraint. Each amplifier draws 20 µA typical supply current, and the pair operates from a single supply rail between 1.8 V and 7 V.

The 160 kHz gain-bandwidth product sets the closed-loop bandwidth at a given gain: at gain 100, expect roughly 1.6 kHz of usable bandwidth. The 0.08 V/µs slew rate limits large-signal response — a 1 V step slews in about 12.5 µs, which is fine for DC measurement but too slow for audio or fast ADC driving. The picoamp-level bias makes the part suitable for high-impedance sources like pH probes or piezoelectric sensors without needing a separate JFET buffer. The 2 mV offset is typical for a general-purpose CMOS stage — budget for system calibration if the signal chain requires sub-millivolt accuracy.

The part is RoHS compliant. The 8-VFSOP package is a standard Toshiba footprint, and the supplier device package is 8-SSOP — the two designations refer to the same body outline, so PCB footprints are interchangeable.

8-VFSOP package — rework and footprint notes

The 8-VFSOP package measures 0.091" (2.30 mm) body width with a 0.50 mm lead pitch. The narrow pitch means the solder stencil apertures should be sized to avoid bridging — a 0.25 mm stencil thickness with 1:1 aperture-to-pad ratio is a safe starting point. Rework with hot air is feasible: the small thermal mass reflows quickly at 240–260 °C peak, but the fine pitch demands careful alignment.

Frequently asked questions

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