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Toshiba Semiconductor HN1D01FU,LF(T

HN1D01FU,LF(T Diode Array, 80V 100mA, 4ns trr, US6

MPNHN1D01FU,LF(T
End of Life

Toshiba HN1D01FU,LF(T general-purpose diode array, 80 V reverse, 100 mA per diode, 4 ns trr, 2-pair common anode, US6 package, ROHS3 compliant.

$0.45Ref. price · indicative, final on quote
Packaging6-TSSOP, SC-88, SOT-363
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

HN1D01FU,LF(T Technical Specifications
ParameterValue
Mounting typeSurface Mount
Voltage - DC reverse (Vr)80 V
Voltage - forward (Vf) (Max) @ if1.2 V @ 100 mA
Current - reverse leakage @ vr500 nA @ 80 V
Current - average rectified (Io) (per diode)100mA
Operating temperature - junction125°C (Max)
SpeedSmall Signal =< 200mA (Io), Any Speed
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyStandard
Case6-TSSOP, SC-88, SOT-363
Diode configuration2 Pair Common Anode
Reverse recovery time4 ns

Product details

80 V, 100 mA per diode — small-signal switching array in US6

The Toshiba HN1D01FU,LF(T is a general-purpose diode array containing two pairs of diodes with a common anode configuration, each rated for 80 V reverse voltage and 100 mA average rectified current. With a 4 ns reverse recovery time, this array is suited for high-speed switching tasks in signal conditioning, protection clamping, and logic-level translation circuits. The 500 nA maximum reverse leakage at 80 V and 1.2 V forward drop at 100 mA define the static losses for low-power designs.

US6 package — footprint and thermal considerations

Housed in the 6-pin US6 package (SC-88 / SOT-363 variant), this surface-mount array occupies minimal board area and is compatible with standard reflow profiles. The junction temperature is rated to 125 °C maximum; thermal performance depends on PCB copper area and airflow in the end application.