USB 1.x parallel controller for legacy bus integration
The Texas Instruments USBN9604SLB is a USB controller supporting USB 1.0 and 1.1 protocols through a parallel interface. This makes it a fit for desktop peripherals, legacy industrial panels, or test equipment that needs a USB 1.x bridge without the overhead of an integrated MCU.
Supply range and current budget
The 30 mA supply current is modest — a 5 V rail with 150 mA headroom can power the controller plus a handful of pull-ups and LEDs.
Package and footprint considerations
The 28-TFQFN CSP package (5.5x4.5 mm) is a fine-pitch, leadless package. The CSP variant means the die is face-down on the substrate — no exposed pad for thermal dissipation, so junction temperature rise is purely through the board. Reflow profile must match the package's moisture sensitivity level (MSL not stated in this listing, but typical for TFQFN is MSL 3). A bake before reflow is prudent if the moisture-barrier bag has been open. The small footprint saves board area but requires a microscope for inspection and a stencil with tight aperture control.
Active lifecycle — no near-term obsolescence risk
For a BOM line, this removes the urgency of a lifetime buy or a forced qualification of a replacement.