Package and mounting — what the 15-DSBGA means for assembly
The TPS65132T6YFFR is supplied in a 15-bump DSBGA package (15-DSBGA). This wafer-level chip-scale package requires surface-mount assembly with a solder-paste stencil matched to the ball pitch.
Lifecycle and sourcing reality
The TPS65132T6YFFR carries an Active product status per TI's lifecycle coding, with ROHS3 compliance confirmed. If you are filling a BOM line or qualifying a second source for a display bias supply, this part is a straightforward drop-in with no LTB risk.
