TMS5701224CPGEQQ1

Texas Instruments · Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R Series

Texas Instruments Hercules TMS570 ARM Cortex-R4F, TMS5701224CPGEQQ1, 16/32-Bit MCU, 160MHz, 1.25MB Flash, 192K x 8 RAM, 64K x 8 EEPROM, CANbus, LINbus, SPI, I2C, 64 I/O, -40 to 125°C, 144-LQFP, AEC-Q100, Tray.

Texas Instruments TMS5701224CPGEQQ1
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Technical specifications

TMS5701224CPGEQQ1 specifications
Parameter / AttributeSpecification / Value
SeriesAutomotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R
MountingSurface Mount
Oscillator typeExternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.14V ~ 3.6V
Operating temperature-40°C ~ 125°C (TA)
Speed160MHz
PackageTray
RAM size192K x 8
Core size16/32-Bit
EEPROM size64K x 8
PeripheralsDMA, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Number of i (O)64
Core processorARM® Cortex®-R4F
Case144-LQFP
Data convertersA/D 24x12b
Program memory size1.25MB (1.25M x 8)

Technical details

160 MHz Cortex-R4F — what the clock buys you

The 160 MHz core speed sets the timing budget for your control loop. The Cortex-R4F is a real-time control processor with a floating-point unit, so that clock translates to deterministic loop closure for motor control, braking systems, or powertrain management.

Memory map and peripheral set for an automotive ECU

With 1.25 MB of Flash, 192 KB of RAM, and 64 KB of EEPROM, this part can hold a substantial firmware image — enough for a full AUTOSAR stack or a custom motor-control algorithm with data logging. The 64 KB EEPROM block is separate from the Flash, so you can write calibration parameters or fault codes without wearing the program memory. The peripheral set includes CAN, LIN, SPI, I2C, SCI, and a MibSPI (multi-buffered SPI for high-throughput sensor reads). There are 64 general-purpose I/O pins and a 24-channel 12-bit ADC. The DMA and PWM modules handle the real-time data movement and actuator drive without loading the core.

Package and temperature grade — 144-LQFP at 125°C

The 144-pin LQFP (20x20 mm) is a hand-solderable package — no BGA rework station needed.

Lifecycle and sourcing — still active, no LTB risk

For a new design, this means you can qualify it without worrying about an imminent end-of-life. The part is ROHS3 compliant.

TMS5701224CPGEQQ1
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