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Texas Instruments TLV2773CN — Logic ICs
Texas Instruments

TLV2773CN CMOS Dual Op-Amp, 5.1 MHz, Rail-to-Rail Output

MPNTLV2773CN
End of Life

Texas Instruments TLV2773CN, Automotive AEC-Q100, CMOS dual operational amplifier, 5.1 MHz gain bandwidth, 10.5 V/µs slew rate, rail-to-rail output, 2.5 V to 5.5 V supply, 14-DIP through-hole package, 0°C to 70°C.

$1.32Ref. price · indicative, final on quote
TLV2773CN datasheet
Packaging14-DIP (0.300", 7.62mm)
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

TLV2773CN Technical Specifications
ParameterValue
SeriesAutomotive, AEC-Q100
Output typeRail-to-Rail
Mounting typeThrough Hole
Amplifier typeCMOS
Voltage - input offset700 µV
Voltage - supply span5.5 V
Current - supply1mA (x2 Channels)
Current - input bias2 pA
Current - output (Channel)50 mA
Operating temperature0°C ~ 70°C
Gain bandwidth product5.1 MHz
PackageBulk
Slew rate10.5V/µs
Case14-DIP (0.300\", 7.62mm)
Number of circuits2

Product details

Dual CMOS op-amp with rail-to-rail output in a through-hole DIP

The TLV2773CN: The input bias current is 2 pA, and the input offset voltage is 700 µV.

5.1 MHz GBW and 10.5 V/µs slew — what they mean for signal conditioning

The 5.1 MHz gain-bandwidth product supports small-signal amplification up to several hundred kilohertz with moderate closed-loop gain, suitable for sensor conditioning, audio line-level stages, or low-speed ADC drivers. The rail-to-rail output lets the signal swing close to the supply rails, useful in single-supply systems where headroom is tight.

Through-hole 14-DIP — assembly and storage notes

The 14-DIP (0.300", 7.62 mm) through-hole package is hand-solder or wave-solder only — no reflow profile needed. The supplier device package is 14-PDIP. MSL is not specified in the listing, but DIP packages are generally MSL 1 (no moisture sensitivity), so dry-storage precautions are minimal. Store the reels or tubes in a standard ESD-safe environment; no bake required before assembly.

Frequently asked questions

Is TLV2773CN AEC-Q100 qualified?

Yes, the TLV2773CN is listed under the Automotive, AEC-Q100 series, indicating it has passed automotive-grade reliability qualification.

Is TLV2773CN a surface mount device?

No, the TLV2773CN is a through-hole device in a 14-DIP (14-PDIP) package. It is not a surface-mount component.

What is the equivalent of TLV2773CN?

A close functional equivalent is the TLV9362IDDFR, a dual general-purpose op-amp with 10.6 MHz GBW, 25 V/µs slew rate, and rail-to-rail output in a surface-mount package. Pin compatibility should be verified against the respective datasheets.