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Texas Instruments TLV2762CDGK — Logic ICs

TI TLV2762CDGK Dual Op-Amp, 500 kHz GBW, 0.23 V/µs Slew Rate

MPNTLV2762CDGK
End of Life

Texas Instruments TLV2762CDGK, dual general-purpose op-amp, 500 kHz gain bandwidth, 0.23 V/µs slew rate, 20 µA supply per channel, rail-to-rail output, 1.8 V to 3.6 V supply, 8-VSSOP package, 0°C to 70°C.

$2.49Ref. price · indicative, final on quote
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

TLV2762CDGK Technical Specifications
ParameterValue
Output typeRail-to-Rail
Mounting typeSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset550 µV
Voltage - supply span3.6 V
Current - supply20µA (x2 Channels)
Current - input bias3 pA
Current - output (Channel)10.2 mA
Operating temperature0°C ~ 70°C
Gain bandwidth product500 kHz
PackageTube
Slew rate0.23V/µs
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)
Number of circuits2

Product details

20 µA per channel — the battery-budget op-amp

The TLV2762CDGK: The rail-to-rail output stage lets it swing close to the supply rails, preserving dynamic range in low-voltage single-supply designs. With a 500 kHz gain-bandwidth product and 0.23 V/µs slew rate, it handles slow-moving signals like temperature, pressure, or humidity sensor outputs without wasting power.

A slew rate of 0.23 V/µs limits the large-signal bandwidth. That is fine for DC or low-frequency conditioning — thermocouple amplifiers, photodiode front-ends, battery monitoring. The 3 pA input bias current and 550 µV input offset voltage are typical for this power class.

Commercial temperature range — indoor use only

That is a commercial-grade temperature window — office equipment, consumer electronics, bench-top instruments, and indoor IoT gateways. It is not qualified for automotive under-hood, outdoor telecom cabinets, or factory-floor environments where the ambient regularly exceeds 70°C. For extended temperature requirements, look at the TLV276x family variants with an I or Q suffix.

Package and footprint — 8-VSSOP

Housed in an 8-VSSOP (also known as 8-MSOP with 0.118-inch body width), the TLV2762CDGK occupies about 3 mm × 3 mm board area. The supplier device package is 8-VSSOP, which matches the standard 8-MSOP footprint. The listed shipping medium is Tube — verify reel or tape options if your pick-and-place line expects Tape & Reel. Surface-mount assembly with standard lead-free profiles;.

ROHS3 compliant. For production BOM planning, this part is not at immediate end-of-life risk, though TI periodically consolidates older low-volume packages — monitor PCNs if the design enters high-volume manufacturing.

Frequently asked questions

Is TLV2762CDGK RoHS compliant?

Yes, the TLV2762CDGK is ROHS3 compliant.