Dual op-amp with 9 MHz GBW and rail-to-rail output
The input bias current is typically 0.7 pA, and each channel can source or sink 28 mA. This combination suits signal conditioning, active filters, and sensor interface circuits where moderate speed and single-supply operation are needed.
A 10 V/µs slew rate means the output can swing 10 V in one microsecond. For a 5 V peak-to-peak signal, that supports full-power bandwidth up to roughly 318 kHz before slew-rate limiting distorts the waveform. This is faster than many general-purpose op-amps (e.g., the classic LM358 at 0.3 V/µs), making the TLV2633IN a better fit for higher-speed ADC drivers, pulse amplification, or waveform generation where the edge rate matters.
If the design sees sustained junction temperatures above 70°C ambient, check the derating curves or consider a wider-temperature variant.
Through-hole DIP — prototyping and legacy boards
The 14-DIP (0.300", 7.62mm) package with through-hole mounting is breadboard-friendly and easy to hand-solder. It is the right choice for lab prototypes, educational kits, or retrofitting existing through-hole PCB layouts. For high-density or automated assembly, surface-mount alternatives in the same family (e.g., TLV2633IDR in SOIC-8) are available, but the DIP version gives the rework tech a clear advantage during debug.