Skip to main content
Texas Instruments TLE2074AMFKB — Logic ICs

TLE2074AMFKB JFET Op-Amp, 10 MHz, 45 V/µs, 20-CLCC

MPNTLE2074AMFKB
End of Life

Texas Instruments Excalibur TLE2074AMFKB quad JFET op-amp, 10 MHz gain bandwidth, 45 V/µs slew rate, 25 pA input bias, 500 µV offset, 4.5–38 V supply, -55 to 125 °C, 20-CLCC ceramic package.

$53.09Ref. price · indicative, final on quote
Packaging20-CLCC
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

TLE2074AMFKB Technical Specifications
ParameterValue
Mounting typeSurface Mount
Amplifier typeJ-FET
Voltage - input offset500 µV
Voltage - supply span4.5 V
Current - supply6.5mA (x4 Channels)
Current - input bias25 pA
Current - output (Channel)48 mA
Operating temperature-55°C ~ 125°C (TA)
Gain bandwidth product10 MHz
PackageBulk
Slew rate45V/µs
Case20-CLCC
Number of circuits4

Product details

Quad JFET op-amp for high-impedance, wide-temperature signal chains

With a supply range spanning 4.5 V to 38 V, it can run from a single 5 V rail or split ±15 V supplies common in industrial analog front-ends.

A 45 V/µs slew rate means this op-amp can swing a 10 V peak-to-peak output in about 220 ns. For a 10 MHz GBP part, that slew rate supports full-power bandwidth well into the hundreds of kilohertz — useful for driving ADC inputs, reconstruction filters, or fast multiplexed analog muxes without slew-induced distortion. The 48 mA output current per channel gives it enough drive to handle moderate capacitive loads or multiple feedback-network taps.

Hermetic 20-CLCC: package reality for high-reliability builds

The 20-lead ceramic leadless chip carrier (20-LCCC, 8.89x8.89 mm) is a surface-mount hermetic package. It requires reflow profiles compatible with ceramic — typically a slower ramp and higher peak temperature than standard FR-4 reflow. The package has no exposed thermal pad; thermal management relies on board-level copper planes and via stitching under the package. For space or defence programs, the ceramic construction passes outgassing and particle-impact noise tests that plastic packages fail.

Active lifecycle — no near-term EOL concern

For a military-temperature, hermetic-package op-amp, active status is valuable — it means the part is still in regular production and available through distribution, not limited to surplus or broker channels.

Frequently asked questions

Is TLE2074AMFKB a direct replacement for TLE2074MJB?

The TLE2074AMFKB and TLE2074MJB share the same Excalibur JFET op-amp core, but the suffix differences may indicate package or temperature grade variations. Without an official cross-reference from TI, verify pinout, package footprint, and temperature range against your existing BOM before substituting.

What are the best lower-cost alternatives to TLE2074AMFKB?

Both are plastic-package parts with narrower temperature ranges but significantly lower per-unit cost. Neither is a drop-in replacement — evaluate supply voltage, package, and channel count against the TLE2074AMFKB.