It delivers a 1 MHz gain-bandwidth product with a 3.5 V/µs slew rate while drawing only 200 µA of supply current. The JFET input stage provides 30 pA typical input bias current, making it suitable for high-impedance signal conditioning, precision integrators, and low-level sensor amplification in temperature-controlled environments (0°C to 70°C).
The TL061CJG operates from a total supply span of 10 V to 30 V, which means it can run on ±5 V to ±15 V dual supplies or a single 10 V to 30 V rail. The 200 µA typical quiescent current keeps the power dissipation low — useful in multi-channel boards where thermal budget is tight. For a ±15 V supply, the total draw is about 6 mW per amplifier, so a dozen of these on a card still stay under 75 mW of op-amp quiescent loss.
The 8-CDIP (0.300", 7.62mm) is a through-hole ceramic dual-in-line package. It is not compatible with standard lead-free reflow profiles — the package body is hermetic, but the leads are tin/lead solder-dipped (RoHS non-compliant per). For new designs, this means hand-soldering or wave-solder assembly only, and the board must accept leaded solder. If you are retrofitting a legacy board that originally used a plastic DIP, the pinout is the same, but the 0.300" width matches standard 8-pin DIP sockets.
Lifecycle and sourcing — active but niche
However, the CDIP package and RoHS non-compliant finish limit its production volume — it is not a high-volume surface-mount part. Expect availability through independent distribution rather than factory-direct in large tape-and-reel quantities. If your design can tolerate a plastic DIP or SOIC package, the commercial-grade TL061 variants (e.g., TL061CP) share the same electrical specs and are more readily stocked.