3x3 mm QFN — thermal via stitch or watch it climb
The 16-VFQFN with exposed pad (3x3 mm body) is the only package option. At 14.2 mA supply current, the die dissipates about 70 mW at 5 V — not huge, but at 570 V/µs edge rates the internal switching losses add up. The exposed pad needs a solid via-stitched ground plane to keep junction temperature under control. Without it, the thermal resistance climbs and the part may hit thermal shutdown during sustained high-frequency operation. The pad is the only thermal path; don't rely on the tiny perimeter pins.
Not rated for automotive under-hood use (no AEC-Q100), but fine for cabin or lab gear.