The 3-state outputs let multiple transceivers share a bus without contention — the classic backplane or memory-bus buffer role. Output drive is rated 32 mA source and 64 mA sink, enough to drive a heavily loaded parallel bus or a bank of LED indicators through a series resistor. The asymmetric sink strength is typical for bipolar CMOS (BiCMOS) output stages in the 74LVTH series — the extra sink current handles capacitive discharge on falling edges.
20-TSSOP footprint — layout and thermal
The 20-TSSOP package (0.173" body width, 4.40 mm) is a standard fine-pitch SOIC footprint. The 0.65 mm lead pitch routes easily on two-layer boards with 8/8 mil trace/space rules. No thermal pad or exposed paddle — junction-to-ambient thermal resistance is package-limited, so keep the ambient under 85°C for full drive current.
No lead, no halogens in the molding compound.