Package reality: 5-DSBGA
The 5-DSBGA package measures 1.4x0.9mm — roughly the size of a grain of sand. That saves board area but demands careful PCB layout: the BGA pads are under the part, so you need a soldermask-defined pad pattern and X-ray inspection after reflow. This is not a hand-solderable part; it goes through a pick-and-place line with a stencil. For prototyping, TI offers the same gate in larger packages like SOT-23 or SC-70 under different order codes.
Temperature grade and environment
Rated -40°C to 85°C, which covers industrial control, outdoor telecom cabinets, and automotive cabin environments. Not qualified to AEC-Q100.
Sourcing and lifecycle
TI lists this part as Active with ROHS3 compliance. No end-of-life notice or last-time-buy window is in effect.
