Through-hole DIP — board fit and sourcing note
The 20-pin DIP (0.300" row spacing) is a standard footprint for through-hole boards. It mates with 20-pin DIP sockets or can be soldered directly. The 8mA output drive per channel is adequate for point-to-point logic links and short bus segments; for heavily loaded backplanes or long cables, a higher-drive family (e.g., 74ABT with 32mA output) would be needed.
Lifecycle and compliance
No end-of-life notice or last-time-buy schedule is in effect. For new designs, it remains a valid choice; for existing BOMs, no supply-risk flag is raised.
