Package and mounting — TO-252-3 (DPak)
The SM72238TDE-5.0/NOPB comes in a TO-252-3 (DPak) surface-mount package with a tab for heat sinking. The tab is the output (drain) connection; the PCB copper area under the tab serves as the primary thermal path. For 100 mA at moderate dropout, a 1-inch-square copper pour on a standard 1 oz board keeps the junction well within the 125°C limit. The package is compatible with standard reflow profiles and does not require special handling beyond normal MSL precautions.
Protection and reliability
Built-in over-current and over-temperature protection reduce the need for external supervisory components.
Lifecycle and sourcing
The SM72238TDE-5.0/NOPB is listed as Active with no end-of-life notice. That means it remains in TI's current production portfolio, and there is no last-time-buy pressure. For new designs, this part can be specified without obsolescence risk.
