O9039A385IZWSRQ1

Texas Instruments

Texas Instruments O9039A385IZWSRQ1, Automotive PMU for Processor, AEC-Q100, 3.135V–5.25V supply, 11mA supply current, -40°C to 85°C, 169-LFBGA package, Surface Mount.

Texas Instruments O9039A385IZWSRQ1
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[IN STOCK] In Stock: 51 pcs
$15.82/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

O9039A385IZWSRQ1 specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Supply voltage3.135V ~ 5.25V
Current - supply11mA
Operating temperature-40°C ~ 85°C (TA)
GradeAutomotive
PackageTape & Reel (TR); Cut Tape (CT)
ApplicationsProcessor
QualificationAEC-Q100
Case169-LFBGA

Technical details

The O9039A385IZWSRQ1 is an automotive-grade power management unit (PMU) designed specifically for processor loads. It integrates multiple regulated output rails and sequencing logic to power an SoC or MCU from a single wide-range input of 3.135V to 5.25V. The part draws 11mA quiescent current, which is the total overhead for the internal bias and control circuits — not the load current delivered to the processor. At that supply current, this PMU is sized for low-to-mid complexity processor subsystems, not high-current core rails. It is not rated for underhood (grade-0) environments, so verify the thermal profile of the end location before committing the BOM.

169-LFBGA package — what the layout engineer needs to know

The 12x12 array with 0.8 mm or 0.65 mm pitch (not specified in this listing, but typical for 169-LFBGA) demands controlled-impedance routing for any high-speed signals and a solid ground plane beneath the package. Via-in-pad with filled vias is standard for BGA assembly; expect to use X-ray inspection for solder-joint verification after reflow. The supplier device package is 169-NFBGA (12x12) — note the 'N' indicating a lead-free, halogen-free build.

For an automotive PMU, active lifecycle means no near-term last-time-buy or EOL notice. This is a clean fit for a new design-in without supply-chain contingency planning around obsolescence.

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