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Texas Instruments MSP430FR5970IRGCR — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430FR5970IRGCR 16-bit MCU, 32KB FRAM, 16 MHz, 64-VQFN

MPNMSP430FR5970IRGCR
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Texas Instruments MSP430FR5970IRGCR, 16-Bit MSP430 CPUXV2, 16MHz, 32KB (32K x 8) FRAM, 2K x 8 SRAM, 51 I/O, 8x12b ADC, I²C/IrDA/SCI/SPI/UART/USART, 1.8V~3.6V, -40°C~85°C, 64-VFQFN Exposed Pad, 64-VQFN (9x9).

$2.5281Ref. price · indicative, final on quote
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Specifications

MSP430FR5970IRGCR Technical Specifications
ParameterValue
SeriesMSP430™ FRAM
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR)
RAM size2K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, SCI, SPI, UART/USART
Number of i (O)51
Core processorMSP430 CPUXV2
Case64-VFQFN Exposed Pad
Data convertersA/D 8x12b
Program memory size32KB (32K x 8)

Product details

FRAM-based 16-bit MCU for low-power sensing and control

It packs 32 KB of FRAM program memory and 2K x 8 of SRAM, with 51 general-purpose I/O lines and an 8-channel 12-bit ADC. FRAM gives you non-volatile storage that writes at bus speed with essentially unlimited endurance — no EEPROM wear-out to budget for in firmware updates or data logging.

16 MHz CPU — enough for real-time loops, not for number crunching

The 16 MHz clock is the ceiling for this core. It handles sensor polling, PID loops, and protocol parsing without breaking a sweat, but you won't run heavy DSP or floating-point math here — that's not what this family is for. The FRAM lets you treat program memory like RAM for data structures, so you can log telemetry or store calibration tables without a separate EEPROM.

64-VQFN exposed pad — reworkable with care

The 64-VFQFN package (9x9 mm body) has an exposed thermal pad underneath. That pad needs a solid via stitch to the ground plane to pull heat out of the die. For rework, the standard hot-air profile for a 0.5 mm pitch QFN works — preheat the board to 150°C, then hit the package at 320°C until the solder reflows. The pad is large enough that you can lift the part without lifting the pad if you work the corners first.

Frequently asked questions

Is MSP430FR5970IRGCR obsolete?

TI has not issued any discontinuation notice for this order code.

What is the difference between MSP430FR5970IRGCR and MSP430FR5969?

The MSP430FR5969 is a close sibling in the same FRAM family, typically with the same core and peripheral set but often in a different package or with minor memory variations. The exact differences in memory size and package options should be checked against the TI product cross-reference. Both are active and pin-compatible across the 64-pin QFN footprint, so a swap may be possible with a firmware recompile.