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Texas Instruments MSP430FR5962IRGZR — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430FR5962IRGZR 16-Bit MCU, 128KB FRAM, 16MHz, 48-QFN

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Texas Instruments MSP430™ FRAM MSP430FR5962IRGZR, 16-Bit MCU with CPUXV2 core at 16MHz, 128KB FRAM, 8K x 8 SRAM, 40 I/O, 12-bit ADC, 1.8V~3.6V supply, -40°C~85°C, 48-VFQFN exposed pad.

$7.7500Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MSP430FR5962IRGZR specifications
ParameterValue
SeriesMSP430™ FRAM
MountingSurface Mount
Oscillator typeExternal, Internal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size8K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, SPI, UART/USART
Number of i (O)40
Core processorMSP430 CPUXV2
Case48-VFQFN Exposed Pad
Data convertersA/D 16x12b
Program memory size128KB (128K x 8)

Product details

128 KB FRAM — the non-volatile memory that writes like RAM

The 8K x 8 SRAM handles runtime data. This is the part to pick when your firmware needs frequent field updates or you want to log data without wearing out the memory array.

The 40 GPIOs give headroom for parallel interfaces or a modest keypad-and-display panel.

48-VFQFN with exposed pad — rework and layout notes

Housed in a 48-VFQFN (7x7 mm) with an exposed thermal pad. The pad needs a solid via-stitch to the ground plane — without it, the junction temp climbs fast above 60°C ambient under sustained ADC conversions. For rework: preheat the board to 125°C, hit the QFN with hot air at 320°C, and lift the part once the solder flows uniformly. The pad is center-ground, so reflow alignment is forgiving, but check the orientation dot — it's small on this package.

The FRAM technology draws near-zero standby current — the real power story is the active-mode current at 16 MHz, which stays under 300 µA typical in the family. That makes this MCU a strong candidate for battery-powered edge nodes where a 32-bit ARM would burn too much quiescent current.

Frequently asked questions

Where can I buy MSP430FR5962IRGZR?

Submit a request for current pricing, stock position, and lead time — availability and price are confirmed at quote time.

What is the difference between MSP430FR5962IRGZR and MSP430FR5962IRGZT?

The silicon and package are identical — both are the same MSP430FR5962 die in a 48-VFQFN. The difference is the reel quantity: the IRGZR suffix ships in Tape & Reel (TR) with a higher count, while the IRGZT variant comes in Cut Tape (CT) typically in smaller reel quantities. For production, the IRGZR is the standard volume reel.

Is MSP430FR5962IRGZR RoHS compliant?

Yes, the MSP430FR5962IRGZR is RoHS compliant. The 48-VFQFN package is lead-free and compatible with lead-free reflow profiles.

How to program MSP430FR5962IRGZR?

Programming is done through the Spy-Bi-Wire (SBW) two-wire JTAG interface, which is TI's reduced-pin debug/programming protocol for the MSP430 family. A standard MSP430 programmer like the MSP-FET or eZ-FET tool connects to the SBW pins. The FRAM memory supports fast writes without erase cycles, so firmware updates are quicker than with Flash-based MCUs.