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Texas Instruments MSP430FR50431IRGCT — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430FR50431IRGCT 16-Bit MCU, 64KB FRAM, 16MHz, 64-VQFN

MPNMSP430FR50431IRGCT
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Texas Instruments MSP430FR50431IRGCT, MSP430™ FRAM series, 16-Bit MCU, MSP430 CPUXV2 core, 16MHz, 64KB FRAM, 12K x 8 RAM, 44 I/O, 1.8V~3.6V supply, -40°C~85°C, 64-VFQFN Exposed Pad.

$8.7842Ref. price · indicative, final on quote
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MOQ1 pcs
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  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MSP430FR50431IRGCT Technical Specifications
ParameterValue
SeriesMSP430™ FRAM
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR)
RAM size12K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityIrDA, SCI, SPI, UART/USART
Number of i (O)44
Core processorMSP430 CPUXV2
Case64-VFQFN Exposed Pad
Data convertersA/D 9x12b SAR
Program memory size64KB (64K x 8)

Product details

64 KB FRAM — why it changes the memory decision

Its program memory is 64 KB of FRAM (ferroelectric RAM), which combines non-volatile storage with write speeds close to SRAM and endurance rated for 10^15 cycles — orders of magnitude beyond typical Flash. The 12K x 8 RAM provides working space for moderate-sized buffers and stacks.

I/O and peripheral mix for sensor and control loops

With 44 I/O lines, this MCU can handle a mix of digital sensors, keypad matrices, and control outputs without an external port expander. The integrated 9-channel 12-bit SAR ADC covers analog inputs like thermistors or current shunts. Connectivity includes IrDA, SCI, SPI, and UART/USART, so it can talk to serial peripherals, wireless modules, or a host controller. Brown-out detect and POR keep the system from locking up on a droopy supply rail.

Supply and temperature — industrial floor ready

The 64-VFQFN package with exposed pad helps pull heat out through the PCB ground plane — important if the MCU is driving several outputs simultaneously.

Frequently asked questions

What package type is MSP430FR50431IRGCT?

It comes in a 64-VFQFN exposed pad package, with the supplier device package listed as 64-VQFN (9x9). The exposed pad aids thermal dissipation when soldered to a PCB ground plane.