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MSP430FR4133IG56

TI MSP430FR4133IG56 16-bit MCU, 16 MHz, 15.5 KB FRAM

MPNMSP430FR4133IG56
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Texas Instruments MSP430™ FRAM series, MSP430FR4133IG56, 16-bit MCU, 16MHz, 15.5KB FRAM, 2K x 8 SRAM, 52 I/O, I²C/SPI/UART, A/D 8x10b, -40°C~85°C, 56-TSSOP.

$3.7100Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MSP430FR4133IG56 specifications
ParameterValue
SeriesMSP430™ FRAM
MountingSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTube
RAM size2K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, LCD, POR, PWM, WDT
ConnectivityI²C, IrDA, SCI, SPI, UART/USART
Number of i (O)52
Core processorMSP430 CPU16
Case56-TFSOP (0.240\", 6.10mm Width)
Data convertersA/D 8x10b
Program memory size15.5KB (15.5K x 8)

Product details

It carries 15.5 KB of FRAM program memory and 2 KB of SRAM, with 52 general-purpose I/O lines. FRAM is the key differentiator here: it unifies code and data storage in a single non-volatile memory that writes at bus speed, draws near-zero standby power, and endures 10^15 write cycles — no separate EEPROM needed, no Flash page-erase penalty.

FRAM memory — the design decision that changes the firmware strategy

15.5 KB of FRAM is both the program store and the data EEPROM. There is no separate Flash-to-RAM copy step on boot — code executes directly from FRAM, and variables can live in the same space without wear-leveling logic. For a firmware engineer, this means field updates over I²C or UART are simpler: you write new code directly to FRAM at byte granularity, no erase cycle, no sector management. The 2 KB SRAM is available for stack and scratch buffers. The internal oscillator is the default clock source, so the board needs no external crystal for most applications, though the clock tree supports external sources if timing accuracy demands it.

56-TSSOP package — footprint for the PCB layout engineer

The MSP430FR4133IG56 comes in a 56-lead TSSOP (body 6.10 mm wide, 0.5 mm pitch, per the 56-TFSOP case code). Surface-mount only. Decoupling: a 0.1 µF ceramic per supply pin pair, placed as close to the package as the pitch allows, with a bulk 4.7 µF or 10 µF on the board-level 3.3 V rail.

For the procurement desk: this part does not carry a single-source risk flag — TI's MSP430 FRAM family has multiple density and package variants, but the IG56 (56-TSSOP) is the specific footprint. If a second-source or drop-in alternate is needed, the closest pin-compatible sibling within the same family would be another MSP430FR4xxx in the 56-TSSOP package — verify the FRAM size and peripheral set against the BOM requirements.

Frequently asked questions

What is the closest pin-compatible alternative to the MSP430FR4133IG56?

Within the MSP430 FRAM family, other MSP430FR4xxx devices in the 56-TSSOP package are pin-compatible candidates. The exact FRAM size, SRAM, and peripheral set (e.g., LCD segment count, ADC channels) differ by variant. Verify the BOM's memory and I/O requirements against the datasheet before substituting.