MSP430FR2633IDA TI MSP430 FRAM MCU, 16MHz, 15.5KB, 32-TSSOP
MPNMSP430FR2633IDA
End of Life
Texas Instruments MSP430FR2633IDA, MSP430™ FRAM series, 16MHz 16-bit MCU, 15.5KB FRAM + 4KB SRAM, 19 I/O, 8×10b ADC, I²C/SPI/UART, 1.8–3.6V supply, 32-TSSOP (0.240", 6.10mm), -40°C~85°C.
$4.7400Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | MSP430™ FRAM |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FRAM |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 16MHz |
| Package | Bulk |
| RAM size | 4K x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, IrDA, SCI, SPI, UART/USART |
| Number of i (O) | 19 |
| Core processor | MSP430 CPU16 |
| Case | 32-TSSOP (0.240\", 6.10mm Width) |
| Data converters | A/D 8x10b |
| Program memory size | 15.5KB (15.5K x 8) |
Frequently asked questions
What is the package footprint and MSL rating for reflow assembly?
The FR2633IDA comes in a 32-TSSOP with 0.240 inch (6.10 mm) body width. MSL and peak reflow temperature are datasheet-level parameters not carried in this ledger; for Pb-free assembly at 260 °C peak, verify the moisture sensitivity level and floor-life exposure against the JEDEC J-STD-033 profile before reflow.
How do I source the MSP430FR2633IDA — what is the lead time posture?
Lifecycle is eol_hot with Active status — the channel supply is finite and not expanding. RFQ locks your allocation window; do not treat this as a standard-reel active part with open lead time. Get your PO in before LTB confirmation from TI.