MSP430FR2311IRGYT

Texas Instruments

Texas Instruments MSP430FR2311IRGYT, MSP430™ FRAM series, 16-Bit MCU, 16MHz, 3.75KB FRAM, 1K x 8 RAM, 12 I/O, I²C/SPI/UART, 1.8V-3.6V, -40°C~85°C, 16-VFQFN Exposed Pad.

Texas Instruments MSP430FR2311IRGYT
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MSP430FR2311IRGYT specifications
Parameter / AttributeSpecification / Value
SeriesMSP430™ FRAM
MountingSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size1K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, SCI, SPI, UART/USART
Number of i (O)12
Core processorMSP430 CPU16
Case16-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size3.75KB (3.75K x 8)

Technical details

3.75 KB FRAM — no wear-leveling needed for most logs

FRAM endurance is orders of magnitude beyond EEPROM or Flash — 10^15 write cycles typical. For a 3.75 KB program space, that means you can treat the FRAM as unified memory: code, constant tables, and a small data-logging buffer all live in the same address space without sector-erase delays or wear-leveling schemes. The 1 KB RAM handles stack and temporary variables; the split means a firmware engineer needs to budget carefully for interrupt nesting and buffer sizes, but the FRAM write speed (comparable to SRAM) eliminates the store-to-Flash latency that complicates real-time logging.

Industrial temp range and wide supply — one rail for the sensor node

The industrial temperature grade covers outdoor telecom cabinets, engine-bay-adjacent sensors, and factory-floor controllers.

16-VFQFN with exposed pad — layout checklist

Without that via stitch, the junction temperature rises faster under continuous load — the pad is the primary heat path. The 12 I/O pins are all on the periphery; no centre pins to route.

For a BOM line, this is a green light for new product introduction without planning a second-source qualification window.

MSP430FR2311IRGYT
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