MSP430FR2100IRLLR

Texas Instruments

Texas Instruments MSP430FR2100IRLLR, MSP430™ FRAM series, 16-bit MCU, 16 MHz, 1 KB FRAM, 512 x 8 RAM, 12 I/O, 8x10-bit ADC, IrDA/SCI/SPI/UART, 1.8V–3.6V, -40°C–85°C, 24-VQFN (3x3 mm).

Texas Instruments MSP430FR2100IRLLR
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Technical specifications

MSP430FR2100IRLLR specifications
Parameter / AttributeSpecification / Value
SeriesMSP430™ FRAM
MountingSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size512 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityIrDA, SCI, SPI, UART/USART
Number of i (O)12
Core processorMSP430 CPU16
Case24-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size1KB (1K x 8)

Technical details

16 MHz MSP430 with 1 KB FRAM — ultra-low-power sensor controller

The 512 x 8 RAM handles stack and variable data, while 12 general-purpose I/O lines and an 8-channel 10-bit ADC connect to sensors, switches, and analog inputs.

FRAM program memory — no field-update penalty

The 1 KB FRAM (1K x 8) is the standout feature. Unlike Flash or EEPROM, FRAM writes at bus speed without a page-erase cycle, so the MCU can log data or update firmware in the field with zero write-cycle overhead. For a battery-powered sensor that must store readings every few seconds, this saves microamps compared to a Flash part that would need a charge pump for each write. The 512 x 8 RAM is modest — enough for a small control loop or state machine, but tight for buffering large packets. Plan your stack and variable footprint accordingly.

24-VQFN package — rework considerations

The 24-VQFN (3x3 mm) with exposed thermal pad is a compact package that saves board space but needs a careful rework profile. The pad under the QFN sinks heat fast — a standard hot-air station with a fine nozzle will lift the part clean if you preheat the board first.

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