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Texas Instruments MSP430FR2100IRLLR — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430FR2100IRLLR 16-bit MCU, 16 MHz, 1 KB FRAM, 24-VQFN

MPNMSP430FR2100IRLLR
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Texas Instruments MSP430FR2100IRLLR, MSP430™ FRAM series, 16-bit MCU, 16 MHz, 1 KB FRAM, 512 x 8 RAM, 12 I/O, 8x10-bit ADC, IrDA/SCI/SPI/UART, 1.8V–3.6V, -40°C–85°C, 24-VQFN (3x3 mm).

$0.5124Ref. price · indicative, final on quote
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Specifications

MSP430FR2100IRLLR Technical Specifications
ParameterValue
SeriesMSP430™ FRAM
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size512 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityIrDA, SCI, SPI, UART/USART
Number of i (O)12
Core processorMSP430 CPU16
Case24-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size1KB (1K x 8)

Product details

16 MHz MSP430 with 1 KB FRAM — ultra-low-power sensor controller

The MSP430FR2100IRLLR: It runs at 16 MHz and packs 1 KB of FRAM program memory — non-volatile storage that writes at near-SRAM speed with essentially unlimited endurance, unlike Flash. The 512 x 8 RAM handles stack and variable data, while 12 general-purpose I/O lines and an 8-channel 10-bit ADC connect to sensors, switches, and analog inputs.

FRAM program memory — no field-update penalty

The 1 KB FRAM (1K x 8) is the standout feature. Unlike Flash or EEPROM, FRAM writes at bus speed without a page-erase cycle, so the MCU can log data or update firmware in the field with zero write-cycle overhead. For a battery-powered sensor that must store readings every few seconds, this saves microamps compared to a Flash part that would need a charge pump for each write. The 512 x 8 RAM is modest — enough for a small control loop or state machine, but tight for buffering large packets. Plan your stack and variable footprint accordingly.

24-VQFN package — rework considerations

The 24-VQFN (3x3 mm) with exposed thermal pad is a compact package that saves board space but needs a careful rework profile. The pad under the QFN sinks heat fast — a standard hot-air station with a fine nozzle will lift the part clean if you preheat the board first.

Frequently asked questions

What is the price of MSP430FR2100IRLLR?

Price determines project budget and affects sourcing decisions.

Is MSP430FR2100IRLLR in stock?

Immediate availability is critical for production timelines.

What is the operating temperature range of MSP430FR2100IRLLR?

Ensures the microcontroller can withstand application environment conditions.

What are the alternatives to MSP430FR2100IRLLR?

Helps with second-sourcing or finding a better-fit part for cost or features.

How to program MSP430FR2100IRLLR?

Developers need tool and interface details to implement firmware.

What is the package for MSP430FR2100IRLLR?

Package type determines PCB footprint and assembly compatibility.