The MSP430FG4616IZQWR: It runs at 8 MHz and integrates 92 KB of Flash program memory along with 4 KB of RAM — enough for a moderate-sized control loop, LCD driver code, and sensor data buffering without external memory. What sets this part apart is its on-chip analog: a 12-channel 12-bit ADC and two 12-bit DACs, which let it handle sensor conditioning and actuator drive directly. With 80 general-purpose I/O lines, it can drive a segmented LCD panel, read a keypad matrix, and still have pins left for external peripherals. The 113-ball BGA Microstar Junior package (7x7 mm) keeps the footprint small, but it is a fine-pitch BGA — not a hand-solder part.
The MSP430FG4616IZQWR is marked as Obsolete by Texas Instruments. For a production BOM, this part cannot be sourced through the factory as new stock. If you have a design that depends on this exact MCU, you should qualify a replacement now — or, if you need a small quantity for repair or legacy support, we can source it against an RFQ through our independent distribution network. We confirm availability and current pricing at quote time.
The 8 MHz clock rate places this MCU in the low-power, moderate-throughput tier of the MSP430 family. At 8 MHz, the CPUX core can execute most instructions in one or two clock cycles, giving an effective throughput of roughly 4 to 8 MIPS. That is enough for a real-time control loop sampling sensors at a few kilohertz, updating an LCD display, and handling serial communication — but not for heavy DSP or video processing. The 8 MHz ceiling also means the Flash wait state is zero, so no extra latency penalty for code fetches.
Package and PCB — what the 113-BGA Microstar Junior means
The 113-ball BGA Microstar Junior package measures 7x7 mm with a 0.5 mm ball pitch. That is a fine-pitch BGA — not a part you can hand-solder with a standard iron. It requires a solder-paste stencil, a reflow oven, and X-ray inspection to verify ball wetting. The small footprint is a win for space-constrained designs, but the trade-off is that rework is difficult; if you need to replace the MCU, you will need a hot-air rework station and a BGA reballing kit. The supplier device package code is 113-BGA Microstar Junior (7x7).