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Texas Instruments MSP430F5659IZQWR — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F5659IZQWR 16-bit MCU, 20MHz, 512KB Flash, 113-BGA

MPNMSP430F5659IZQWR
Obsolete

Texas Instruments MSP430F5xx series 16-bit MCU, MSP430F5659IZQWR, 20MHz CPUXV2 core, 512KB Flash, 66K x 8 RAM, USB + I²C/SPI/UART, 74 I/O, 113-BGA Microstar Junior (7x7), -40°C to 85°C.

$1.3500Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MSP430F5659IZQWR Technical Specifications
ParameterValue
SeriesMSP430F5xx
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed20MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size66K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, SCI, SPI, UART/USART, USB
Number of i (O)74
Core processorMSP430 CPUXV2
Case113-VFBGA
Data convertersA/D 16x12b; D/A 2x12b
Program memory size512KB (512K x 8)

Product details

512 KB Flash and 66K RAM — firmware space for complex protocols

With 512 KB of Flash, this MCU can hold a full USB stack, a real-time operating system kernel, and application code for a multi-sensor instrument. The 66K x 8 of RAM (about 66 KB) is generous for a 16-bit part — enough for large data buffers or a modest frame buffer for a small display. No EEPROM is on-chip, but the Flash can be used for non-volatile storage with wear-leveling.

USB 2.0-compatible full-speed device

Obsolete — sourcing through independent distribution

Texas Instruments has marked the MSP430F5659IZQWR as obsolete. No official successor part number has been published for this exact BGA variant. For new production or a BOM line that needs this code, the part is sourced through independent distribution channels — quoted to order against an RFQ. Availability and current pricing are confirmed at quote time. If you need a drop-in replacement, check the MSP430F5xx family for a pin-compatible alternative with similar Flash and RAM; the datasheet pinout is shared across several density options in the same BGA footprint.

Package and layout considerations

The 113-ball BGA Microstar Junior (7x7 mm) is a fine-pitch BGA — not something you can hand-solder with a standard iron. It requires a reflow oven, a solder stencil, and a PCB with microvias or at least via-in-pad capability. The 74 I/O lines give plenty of GPIO for parallel LCDs, keypads, or memory expansion, but every trace out of that BGA needs careful fanout planning. If you're a maker or hobbyist, this package is a tough sell for a breadboard project; look for a TQFP-packaged sibling in the same family instead.

Frequently asked questions

What replaces MSP430F5659IZQWR?

No official direct replacement part number has been published by TI for this specific BGA variant. The MSP430F5xx family includes other devices with similar Flash and RAM in the same BGA footprint — check the family datasheet for pin-compatible density options.

What is MSP430F5659IZQWR's CPU speed?

The MSP430 CPUXV2 core runs at 20 MHz.

Does MSP430F5659IZQWR have USB?

Yes, it includes a USB peripheral supporting full-speed (12 Mbps) operation, compatible with USB 2.0.

What package does MSP430F5659IZQWR come in?

It is supplied in a 113-ball BGA Microstar Junior package measuring 7x7 mm, surface-mount only.