The Texas Instruments MSP430F5633IZQWR is listed as Obsolete. That means TI has stopped production — no further factory orders are accepted. No official replacement order code is recorded in the lifecycle data. If you need a pin-compatible drop-in, the MSP430F5xx family includes multiple density and peripheral variants in the same 113-BGA Microstar Junior footprint — but confirming exact compatibility requires comparing the full pinout and register map against your firmware image.
This is a 16-bit MSP430 CPUXV2 microcontroller running at 20 MHz, with 128 KB of program Flash and 18K x 8 of RAM. The 128 KB program space is sized for moderate-complexity firmware — a USB stack, sensor fusion, or a simple RTOS fits, but a full GUI or file system will push the budget. The peripheral set includes USB 2.0 full-speed (with integrated PHY), two SPI/UART/I²C serial interfaces, IrDA, LIN, and a 16-channel 12-bit ADC.
113-ball BGA — layout and rework considerations
The MSP430F5633IZQWR comes in a 113-VFBGA package, specifically the 7x7 mm Microstar Junior footprint. That's a fine-pitch BGA — 0.5 mm ball pitch typical for this class. The PCB needs via-in-pad or microvias if you route all 74 I/O on a two-layer board; a four-layer stack-up with dedicated power and ground planes is the safer call. BGA rework requires a hot-air station with a bottom preheater and a stencil for solder paste. MSL rating is not in the record, but a 113-ball BGA is typically MSL 3 — bake at 125°C for 24 hours if the moisture-barrier bag has been open longer than the floor-life window.