LM3S615-EGZ50-C2T Stellaris 50MHz ARM Cortex-M3 MCU, 32KB Flash
MPNLM3S615-EGZ50-C2T
End of Life
Stellaris LM3S615-EGZ50-C2T ARM Cortex-M3 MCU, 50MHz, 32KB flash, 8KB RAM, 34 GPIO, I²C/SPI/SSI/UART, 2×10-bit ADC, internal oscillator, 3.3V supply, -40°C to 105°C, 48-VFQFN exposed pad in tape & reel.
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Stellaris® ARM® Cortex®-M3S 600 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 3V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 50MHz |
| Package | Tape & Reel (TR) |
| RAM size | 8K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, Microwire, SPI, SSI, UART/USART |
| Number of i (O) | 34 |
| Core processor | ARM® Cortex®-M3 |
| Case | 48-VFQFN Exposed Pad |
| Data converters | A/D 2x10b |
| Program memory size | 32KB (32K x 8) |
Frequently asked questions
Is the 48-VFQFN exposed pad package suitable for reflow rework without delaminating the pad?
The exposed pad is the primary thermal path and must be soldered to the board pad with thermal vias for rated thermal performance. On rework, prebake before reflow is required to avoid pad delamination — a standard hot-air station approach without prebake is a known failure mode on QFN packages of this generation.