The HD3SS215IRTQR is a specialized HDMI interface IC from Texas Instruments, designed to switch HDMI signals in video routing applications. Its 3V to 3.6V supply rail means it can sit on a standard 3.3V bus without a separate regulator, simplifying the power tree. The part is surface-mount in a 56-VFQFN Exposed Pad package. The exposed paddle must be soldered to a ground-plane via array for thermal relief — the 0.5mm pitch on the outer rows pushes fan-out to inner layers on a four-layer board.
Supply rail and package — what the BOM needs to know
The 3V to 3.6V operating range is a tight window — a 3.3V rail with ±5% tolerance stays inside, but a 3.0V rail at the low end leaves no margin for ripple. The BOM should budget a low-noise LDO if the board's 3.3V rail is shared with switching converters. The 56-VFQFN Exposed Pad measures 8x8 mm. The thermal pad under the package is the primary heat path; without a proper via pattern under the pad, junction temperature rises quickly in a closed chassis. The datasheet's recommended land pattern calls for a 5x5 via array with 0.3 mm finished hole diameter.
Lifecycle and sourcing posture
The Tape & Reel (TR) and Cut Tape (CT) packaging options cover both prototype and production volumes.