27 mOhm on-resistance at 4.5V — conduction loss floor
Maximum Rds(on) is 27 mOhm at Id=5A and Vgs=4.5V. This is the figure that sets the I²R conduction loss in a 5V-driven design. At 5A the dissipation is under 0.7W per channel, well within the 2.3W package power limit when the exposed pad is soldered to a suitable copper area. Gate charge is 5.4 nC max at 4.5V, and input capacitance Ciss is 469 pF at Vds=10V. These numbers keep the gate-drive energy low — a 5V GPIO from a microcontroller or a dedicated driver can switch the pair at moderate frequency without excessive crossover loss.
2x2 mm WSON with exposed pad — layout checklist
The 6-WSON package measures 2x2 mm with an exposed thermal pad. The 0.50 mm pitch is manageable on a two-layer board if the drain and source traces are kept wide enough for 5A. The 150°C ceiling gives headroom in high-ambient environments such as telecom enclosures or automotive cabin-adjacent modules, provided the thermal resistance of the board keeps the junction below the derating threshold at full load.
For a procurement desk qualifying a new BOM, this part does not carry the single-source risk that an NRND or EOL part would.