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Texas Instruments CSD19502Q5B

TI CSD19502Q5B NexFET N-Ch MOSFET, 80V 100A 4.1mΩ

MPNCSD19502Q5B
End of Life

Texas Instruments NexFET™ N-Channel MOSFET, 80 V, 100 A, 4.1 mOhm @ 19 A / 10 V, 62 nC gate charge, 8-VSON-CLIP (5x6) surface-mount package, -55 to 150 °C junction temperature.

$2.65Ref. price · indicative, final on quote
Packaging8-PowerTDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CSD19502Q5B Technical Specifications
ParameterValue
SeriesNexFET™
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage80 V
Drive voltage (Max rds on, min rds on)6V, 10V
Current - continuous drain (Id) @ 25°C100A (Ta)
Power dissipation3.1W (Ta), 195W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id3.3V @ 250µA
Rds on (Max) @ id, vgs4.1mOhm @ 19A, 10V
Gate charge (Qg) (Max) @ vgs62 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds4870 pF @ 40 V

Product details

80 V NexFET™ — low-loss switch for 48 V rails and high-current POL

The Texas Instruments CSD19502Q5B is an 80 V, 100 A N-channel NexFET™ power MOSFET in a VSON-CLIP (5x6) package. It targets high-efficiency DC-DC converters, synchronous rectification stages, and motor-drive half-bridges where conduction loss matters. The 4.1 mΩ typical on-resistance at 10 V gate drive keeps dissipation low at 19 A load current, and the 62 nC gate charge at 10 V lets a standard gate driver switch it fast without excessive drive losses.

Temperature range and package — field fit

Rated for junction temperatures from -55 °C to 150 °C, this part covers industrial and automotive under-hood environments (though it is not AEC-Q101 listed here). The VSON-CLIP (5x6) package uses a large bottom-side pad that must be soldered to a thermal land on the PCB — the datasheet layout recommendation for the copper area is the reference for your board stack-up. Surface-mount reflow is standard; the CLIP construction reduces package resistance and improves current spreading into the die.

Lifecycle and sourcing

The CSD19502Q5B carries an Active product status with ROHS3 compliance. It remains a current-production part suitable for new designs.

Frequently asked questions

What is the lead time for CSD19502Q5B?

Lead time is confirmed at quote time based on current distribution stock. Submit an RFQ for the latest lead time and availability.