CSD17575Q3T

Texas Instruments · NexFET™ Series

Texas Instruments NexFET™ N-Channel MOSFET, 30 V Vdss, 60 A Id, 2.3 mOhm Rds(on) at 10 V, 30 nC Qg at 4.5 V, 8-PowerTDFN (8-VSON-CLIP 3.3x3.3) package, -55 to 150 °C junction.

Texas Instruments CSD17575Q3T
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[IN STOCK] In Stock: 8 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

CSD17575Q3T specifications
Parameter / AttributeSpecification / Value
SeriesNexFET™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C60A (Ta)
Power dissipation2.8W (Ta), 108W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id1.8V @ 250µA
Rds on (Max) @ id, vgs2.3mOhm @ 25A, 10V
Gate charge (Qg) (Max) @ vgs30 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds4420 pF @ 15 V

Technical details

2.3 mOhm at 10 V — the conduction loss floor

The CSD17575Q3T NexFET N-channel MOSFET has a 2.3 mOhm maximum on-resistance at Vgs=10 V and 25 A.

Gate drive and switching edge

Total gate charge is 30 nC at Vgs=4.5 V. Input capacitance is 4420 pF at Vds=15 V. Threshold voltage is 1.8 V at 250 µA.

The 8-VSON-CLIP (3.3x3.3 mm) package uses a large copper clip on the drain pad — the supplier device package code is 8-VSON-CLIP. Power dissipation is rated 2.8 W at 25 °C ambient and 108 W at 25 °C case, so the board copper area under the exposed pad is the limiting factor. A 4-layer board with thermal vias to the inner ground plane keeps the junction below 125 °C at 25 A continuous.

CSD17575Q3T
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