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Texas Instruments CSD17570Q5B

CSD17570Q5B NexFET N-Channel MOSFET, 30V 100A, 0.69 mOhm

MPNCSD17570Q5B
End of Life

Texas Instruments NexFET™ N-Channel MOSFET, 30V Vdss, 100A Id, 0.69 mOhm Rds(on) at 10V, 8-PowerTDFN (5x6 VSON-CLIP), -55°C to 150°C junction.

$2.27Ref. price · indicative, final on quote
Packaging8-PowerTDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CSD17570Q5B Technical Specifications
ParameterValue
SeriesNexFET™
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C100A (Ta)
Power dissipation3.2W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id1.9V @ 250µA
Rds on (Max) @ id, vgs0.69mOhm @ 50A, 10V
Gate charge (Qg) (Max) @ vgs121 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds13600 pF @ 15 V

Product details

Gate charge and switching budget

The CSD17570Q5B: Total gate charge is 121 nC at 4.5 V drive. At a 100 kHz switching frequency, the average gate-drive current needed is about 12 mA — well within a standard MOSFET driver's capability, but the 13600 pF input capacitance at 15 V drain-source means the driver must source a peak current of several amps during the Miller plateau to keep switching edges clean. The drive voltage range (4.5 V to 10 V for rated Rds(on)) allows logic-level drive from a 5 V rail, though the lowest on-resistance is achieved at 10 V.

Thermal reality behind the 100 A rating

The 100 A continuous drain rating is at 25 °C case temperature, but the maximum power dissipation is 3.2 W at 25 °C ambient. In practice, the continuous current is limited by the board's ability to sink heat from the 8-VSON-CLIP (5x6 mm) package.

Package and footprint notes

The 8-PowerTDFN (5x6 VSON-CLIP) package has an exposed drain pad on the bottom. The PCB layout must use multiple vias under the pad to conduct heat to inner copper planes — the datasheet's recommended footprint is non-negotiable for achieving the rated current. Surface-mount assembly with a standard reflow profile works; the package is ROHS3 compliant.

Lifecycle and sourcing posture

It is quoted to order against BOM quantities through independent distribution. No official second-source or pin-compatible alternate is listed in the TI NexFET family — this is a single-source BOM line, so securing a forward commitment from the distributor is recommended for production runs.

Frequently asked questions

What is the CSD17570Q5B datasheet?

Design engineers need full electrical characteristics and pinout to validate fit.

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What is the price of CSD17570Q5B?

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What is the equivalent of CSD17570Q5B?

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Is CSD17570Q5B obsolete?

Maintenance techs and buyers must confirm lifecycle to avoid redesign.

CSD17570Q5B pinout?

Design engineers verify PCB layout compatibility before prototype.