Package and mounting
The CSD17313Q2: The 6-WSON exposed-pad package (2x2 mm body) is a surface-mount design. The exposed pad must be soldered to a thermal land on the PCB to achieve the rated power dissipation. The small footprint suits it for dense layouts, but the pad pattern and via array under the pad are critical for thermal performance — a standard two-layer board with a few thermal vias will handle the 2.3 W, but verify the junction temperature stays below 150°C under worst-case load.
Lifecycle and sourcing
It is ROHS3 compliant.
