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Texas Instruments CSD17309Q3

CSD17309Q3 NexFET N-Ch MOSFET, 30V, 5.4mOhm, 8-VSON

MPNCSD17309Q3
End of Life

Texas Instruments NexFET™ N-Channel MOSFET, CSD17309Q3, 30V Vdss, 20A (Ta) / 60A (Tc), 5.4mOhm Rds(on) at 18A, 8V, 8-VSON-CLIP (3.3x3.3) package.

$1.19Ref. price · indicative, final on quote
Packaging8-PowerTDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CSD17309Q3 Technical Specifications
ParameterValue
SeriesNexFET™
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage30 V
Drive voltage (Max rds on, min rds on)3V, 8V
Current - continuous drain (Id) @ 25°C20A (Ta), 60A (Tc)
Power dissipation2.8W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs+10V, -8V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id1.7V @ 250µA
Rds on (Max) @ id, vgs5.4mOhm @ 18A, 8V
Gate charge (Qg) (Max) @ vgs10 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds1440 pF @ 15 V

Product details

NexFET N-channel at 30 V — what the 5.4 mOhm Rds(on) buys you

The Texas Instruments CSD17309Q3 is an N-channel NexFET power MOSFET rated for 30 V drain-to-source and a continuous drain current of 20 A at 25 °C ambient (60 A at case temperature).

Gate charge and switching edge

Total gate charge is 10 nC at 4.5 V, which means a modest gate driver — say one capable of 1 A peak — can switch this FET in under 20 ns, keeping cross-conduction losses low in a 500 kHz buck converter. Input capacitance Ciss is 1440 pF at 15 V Vds; that figure sets the driver's dynamic power budget and the gate-drive loop's resonant frequency.

Package and thermal path

The 8-VSON-CLIP package (3.3x3.3 mm) uses a copper clip over the die, reducing package resistance and pulling heat into the board's copper plane through the exposed pad. Maximum power dissipation at 25 °C ambient is 2.8 W; in practice the board's copper area and airflow set the real thermal limit — the 60 A case rating assumes a heatsink or large copper pour.

Lifecycle and compliance

It is ROHS3 compliant.

Frequently asked questions

What is the maximum drain current of CSD17309Q3?

The continuous drain current is rated 20 A at 25 °C ambient (Ta) and 60 A at case temperature (Tc). The 60 A figure assumes adequate heatsinking through the exposed pad.