CSD16406Q3

Texas Instruments · NexFET™ Series

Texas Instruments NexFET N-Channel MOSFET, 25V Vds, 19A (Ta) / 60A (Tc), 5.3mOhm Rds(on) at 10V, 8.1nC gate charge, 8-VSON-CLIP surface-mount package, -55 to 150°C junction temperature range.

Texas Instruments CSD16406Q3
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

CSD16406Q3 specifications
Parameter / AttributeSpecification / Value
SeriesNexFET™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage25 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C19A (Ta), 60A (Tc)
Power dissipation2.7W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs+16V, -12V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id2.2V @ 250µA
Rds on (Max) @ id, vgs5.3mOhm @ 20A, 10V
Gate charge (Qg) (Max) @ vgs8.1 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds1100 pF @ 12.5 V

Technical details

The CSD16406Q3 is a Texas Instruments NexFET N-channel MOSFET rated for a 25 V drain-source voltage and a continuous drain current of 19 A at the ambient temperature case (Ta), or 60 A when the case temperature (Tc) is held at 25 °C. The 8-VSON-CLIP package (3.3x3.3 mm) uses a copper clip construction that lowers package resistance and inductance compared to conventional wire-bonded SO-8 devices, which matters for high-frequency switching loops.

Rds(on), gate charge, and driving from logic-level voltages

Maximum on-resistance is 5.3 mOhm at a 20 A drain current with 10 V gate drive — the 4.5 V and 10 V drive voltage levels listed for minimum and maximum Rds(on) mean this MOSFET can be turned on hard with either standard logic-level (5 V) or full 10 V gate drive. The 8.1 nC gate charge at 4.5 V is low enough that a microcontroller GPIO with a series resistor can switch it at moderate frequencies (tens of kHz) without a dedicated gate driver, provided the GPIO source current is adequate to charge the 1100 pF input capacitance within the desired switching time.

Thermal limits and the 19 A vs 60 A current rating

The 2.7 W maximum power dissipation at ambient (Ta) is the limiting factor for a board-level design without heatsinking: at 19 A continuous, the conduction loss alone (I² × Rds(on)) already exceeds 1.9 W at 25 °C junction, leaving little margin. The 60 A case-temperature rating assumes the MOSFET is mounted on a heatsink or PCB copper area that holds the case at 25 °C — a realistic scenario only with a large thermal pad and forced airflow. Derate above 25 °C following the typical Rds(on) temperature coefficient (roughly 0.4 %/°C).

Active production status and sourcing

It is ROHS3 compliant.

CSD16406Q3
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