CSD16401Q5

Texas Instruments · NexFET™ Series

Texas Instruments NexFET™ N-Channel MOSFET, 25V Vdss, 1.6mOhm Rds(on) at 10V, 38A (Ta) / 100A (Tc) continuous drain, 29nC gate charge, 8-VSON-CLIP (5x6) package, -55°C to 150°C junction temperature.

Texas Instruments CSD16401Q5
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

CSD16401Q5 specifications
Parameter / AttributeSpecification / Value
SeriesNexFET™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage25 V
Drive voltage (Max rds on, min rds on)4.5V, 10V
Current - continuous drain (Id) @ 25°C38A (Ta), 100A (Tc)
Power dissipation3.1W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs+16V, -12V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id1.9V @ 250µA
Rds on (Max) @ id, vgs1.6mOhm @ 40A, 10V
Gate charge (Qg) (Max) @ vgs29 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds4100 pF @ 12.5 V

Technical details

NexFET N-channel for low-voltage power stages

The Texas Instruments CSD16401Q5 is a 25 V N-channel NexFET MOSFET in an 8-VSON-CLIP (5x6) package, rated for 38 A continuous drain at 25°C ambient and 100 A at case temperature.

Total gate charge is 29 nC at 4.5 V drive, which keeps the gate-drive energy per cycle low.

Thermal and package reality

The 3.1 W power dissipation at 25°C ambient (Ta) is the limit when the device is mounted on a standard FR-4 board with minimal copper. The 100 A drain current at case temperature (Tc) assumes the bottom-side exposed pad is soldered to a large copper pour and the junction stays below 150°C. The VSON-CLIP package uses a copper clip over the die instead of bond wires, which reduces package resistance and improves heat spreading into the PCB — a real advantage over a conventional DFN in the same footprint.

CSD16401Q5
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