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Texas Instruments CSD16327Q3T

CSD16327Q3T NexFET N-Channel MOSFET, 25V 60A

MPNCSD16327Q3T
End of Life

Texas Instruments NexFET™ N-Channel MOSFET, 25 V drain-to-source, 60 A continuous drain (Tc), 4 mOhm max on-resistance at 24 A, 8-PowerTDFN surface-mount package.

$1.39Ref. price · indicative, final on quote
Packaging8-PowerTDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CSD16327Q3T Technical Specifications
ParameterValue
SeriesNexFET™
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage25 V
Drive voltage (Max rds on, min rds on)3V, 8V
Current - continuous drain (Id) @ 25°C60A (Tc)
Power dissipation74W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs+10V, -8V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id1.4V @ 250µA
Rds on (Max) @ id, vgs4mOhm @ 24A, 8V
Gate charge (Qg) (Max) @ vgs8.4 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds1300 pF @ 12.5 V

Product details

NexFET N-channel for 25 V rails

The Texas Instruments CSD16327Q3T is a NexFET N-channel MOSFET rated for 25 V drain-to-source and 60 A continuous drain current at 25°C case temperature. It comes in an 8-PowerTDFN package with a 3.3x3.3 mm VSON-CLIP footprint, designed for surface-mount power stages where board area is tight. Typical applications include synchronous buck converter low-side switches, OR-ing diodes, and load switches in telecom, computing, and industrial power supplies operating from 3 V to 8 V gate drive.

4 mOhm on-resistance at 24 A

The 4 mOhm max Rds(on) at 24 A and 8 V gate drive keeps conduction losses low in high-current paths. For designs running from a 3 V gate drive, the device still achieves its minimum on-resistance specification.

Active lifecycle, no LTB risk

The NexFET series is a standard TI portfolio, and the CSD16327Q3T is available through independent distribution channels. For BOM planning, the active status means it can be specified into new designs without near-term obsolescence concern.

Package and footprint details

The 8-PowerTDFN package uses a VSON-CLIP construction with an exposed drain pad for thermal management. The supplier device package footprint is 3.3x3.3 mm, which fits into compact power-stage layouts. The device is rated for an operating junction temperature range of -55°C to 150°C, covering industrial and automotive under-hood environments where thermal cycling is a factor.

Frequently asked questions

What is the CSD16327Q3T's on-resistance at 24 A?

The maximum on-resistance is 4 mOhm at 24 A drain current with an 8 V gate drive.