NexFET N-channel for 25 V rails
It comes in an 8-PowerTDFN package with a 3.3x3.3 mm VSON-CLIP footprint, designed for surface-mount power stages where board area is tight. Typical applications include synchronous buck converter low-side switches, OR-ing diodes, and load switches in telecom, computing, and industrial power supplies operating from 3 V to 8 V gate drive.
4 mOhm on-resistance at 24 A
The 4 mOhm max Rds(on) at 24 A and 8 V gate drive keeps conduction losses low in high-current paths. For designs running from a 3 V gate drive, the device still achieves its minimum on-resistance specification.
The NexFET series is a standard TI portfolio, and the CSD16327Q3T is available through independent distribution channels.
Package and footprint details
The 8-PowerTDFN package uses a VSON-CLIP construction with an exposed drain pad for thermal management. The supplier device package footprint is 3.3x3.3 mm, which fits into compact power-stage layouts.