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Texas Instruments CSD16327Q3

CSD16327Q3 NexFET N-Ch 25V 60A MOSFET, 4mOhm Rds(on)

MPNCSD16327Q3
End of Life

Texas Instruments NexFET N-Channel MOSFET, 25 V Drain-Source, 60 A Continuous Drain, 4 mOhm Rds(on) at 8 V, 8-VSON-CLIP (3.3x3.3 mm), -55 to 150 °C Junction.

$1.16Ref. price · indicative, final on quote
Packaging8-PowerTDFN
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

CSD16327Q3 Technical Specifications
ParameterValue
SeriesNexFET™
FET typeN-Channel
Mounting typeSurface Mount
Drain to source voltage25 V
Drive voltage (Max rds on, min rds on)3V, 8V
Current - continuous drain (Id) @ 25°C60A (Tc)
Power dissipation3W (Ta)
Operating temperature-55°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Vgs+10V, -8V
TechnologyMOSFET (Metal Oxide)
Case8-PowerTDFN
Vgs(th) (Max) @ id1.4V @ 250µA
Rds on (Max) @ id, vgs4mOhm @ 24A, 8V
Gate charge (Qg) (Max) @ vgs8.4 nC @ 4.5 V
Input capacitance (Ciss) (Max) @ vds1300 pF @ 12.5 V

Product details

25 V, 60 A NexFET — the switching loss story

The CSD16327Q3 is a 25 V, 60 A N-channel NexFET from Texas Instruments in an 8-VSON-CLIP package. The headline number is the 4 mOhm max on-resistance at 8 V gate drive and 24 A drain current — that is the conduction loss you budget for a 12 V input point-of-load converter or a high-current load switch.

Gate charge is 8.4 nC max at 4.5 V. That is low enough that a 3.3 V logic-level gate driver can switch it without a separate driver IC — the driver only needs to source about 8 nC per switching cycle. The drive voltage range for minimum Rds(on) is 8 V; the part still turns on hard at 3 V, so a 5 V PWM signal from an MCU works for lower-current loads.

Junction temperature range and the 8-VSON-CLIP package

Junction temperature range is -55 to 150 °C — full military temp on the die, so it handles under-hood automotive or outdoor telecom enclosures where ambient hits 85 °C and self-heating adds margin. The 8-VSON-CLIP (3.3x3.3 mm) package uses a copper clip bond instead of wire bonds, which keeps package resistance low and conducts heat into the PCB pad. Hand-solderable with a fine tip if you have a thermal pad on the board; the clip bond is robust enough that a field swap is practical without a hot-air station.

Sourcing and lifecycle posture

ROHS3 compliant.

Frequently asked questions

What is the Rds(on) of CSD16327Q3?

4 mOhm max at 24 A drain current and 8 V gate drive. That is the on-resistance you use for conduction loss calculations in a 12 V or 5 V rail application.

What package is CSD16327Q3 in?

8-VSON-CLIP, 3.3x3.3 mm body. The clip bond construction gives low package resistance and good thermal transfer to the PCB pad — hand-solderable with a fine tip if the board has a thermal pad.