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Texas Instruments CDC3S04YFFR — Clock & Timing ICs

CDC3S04YFFR Clock Buffer 1:4 52MHz DSBGA - TI

MPNCDC3S04YFFR
End of Life

Texas Instruments CDC3S04YFFR, Fanout Buffer (Distribution), 1:4 clock distribution, 52 MHz max frequency, 1.65V–1.95V supply, 20-DSBGA package, -30°C to 85°C operating range.

$3.81Ref. price · indicative, final on quote
Packaging20-UFBGA, DSBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

CDC3S04YFFR Technical Specifications
ParameterValue
TypeFanout Buffer (Distribution)
Mounting typeSurface Mount
Voltage1.65V ~ 1.95V
Frequency52 MHz
Operating temperature-30°C ~ 85°C
InputClock
OutputClock
PackageTape & Reel (TR); Cut Tape (CT)
Case20-UFBGA, DSBGA
Number of circuits1
Ratio - Input:Output1:4
Differential - Input:OutputNo/No

Product details

The CDC3S04YFFR is a single-ended 1:4 fanout buffer from Texas Instruments, designed to distribute a clock signal to up to four loads with minimal added jitter. It accepts a single clock input and outputs four identical clock copies, all within a 1.65V to 1.95V supply rail — common in 1.8V logic systems like FPGAs, MCUs, and SoCs that need a clean clock tree. Maximum frequency is 52 MHz, which covers most microcontroller and low-to-mid-range FPGA clock domains, but not high-speed serial links or RF sampling clocks. The non-differential I/O (single-ended only) means it's best suited for LVCMOS clock trees where skew and noise margin are managed by layout rather than differential routing.

The 1.65V to 1.95V supply range ties this buffer to low-voltage digital cores. If your system already has a 1.8V rail, this part drops in without an extra regulator. The 20-DSBGA package (0.4 mm pitch ball grid array) is compact — about 2.5 mm square — but requires a PCB with micro-vias or fine-trace fan-out. Hand-soldering is impractical; plan for a reflow profile and possibly a stencil. The small footprint saves board space in dense designs.

Active production — sourcing posture

ROHS3 compliant, so it meets the latest EU restriction directives.

Frequently asked questions

What is the datasheet for CDC3S04YFFR?

Design engineers need the datasheet to verify pinout, timing, and electrical characteristics before using the part in a circuit.

Where can I buy CDC3S04YFFR?

Sourcing buyers need immediate purchasing options to fill BOM lines and avoid production delays.

What is the price and availability of CDC3S04YFFR?

Buyers require current pricing and stock levels to make procurement decisions and compare suppliers.

What is the pinout of CDC3S04YFFR?

Design engineers and maintenance techs need the pin configuration to ensure proper board layout and replacement.

Is CDC3S04YFFR RoHS compliant?

Compliance is mandatory for many end products; buyers must confirm RoHS status for regulatory adherence.

What are the alternatives or equivalents to CDC3S04YFFR?

Engineers may need to find second-source parts for supply chain resilience or cost reduction.